- 专利标题: Semiconductor device and method of manufacturing the same
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申请号: US11360288申请日: 2006-02-22
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公开(公告)号: US20060197150A1公开(公告)日: 2006-09-07
- 发明人: Naohiro Ueda , Masato Kijima
- 申请人: Naohiro Ueda , Masato Kijima
- 优先权: JP2005-056850 20050302
- 主分类号: H01L29/76
- IPC分类号: H01L29/76
摘要:
A semiconductor device is disclosed that comprises a high breakdown voltage MOSFET. The MOSFET includes a source region of a second conductivity type and a drain region of the second conductivity type formed apart from each other in a well region of a first conductivity type, a channel region formed between the source region and the drain region, a gate insulation film formed on the channel region, a LOCOS oxide film having a greater film thickness than the gate insulation film and formed adjacent to the gate insulation film, and a gate electrode formed across the gate insulation film and the LOCOS oxide film.
公开/授权文献
- US07476947B2 Semiconductor device and method of manufacturing the same 公开/授权日:2009-01-13
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