• 专利标题: Semiconductor device and method of manufacturing the same
  • 申请号: US11360288
    申请日: 2006-02-22
  • 公开(公告)号: US20060197150A1
    公开(公告)日: 2006-09-07
  • 发明人: Naohiro UedaMasato Kijima
  • 申请人: Naohiro UedaMasato Kijima
  • 优先权: JP2005-056850 20050302
  • 主分类号: H01L29/76
  • IPC分类号: H01L29/76
Semiconductor device and method of manufacturing the same
摘要:
A semiconductor device is disclosed that comprises a high breakdown voltage MOSFET. The MOSFET includes a source region of a second conductivity type and a drain region of the second conductivity type formed apart from each other in a well region of a first conductivity type, a channel region formed between the source region and the drain region, a gate insulation film formed on the channel region, a LOCOS oxide film having a greater film thickness than the gate insulation film and formed adjacent to the gate insulation film, and a gate electrode formed across the gate insulation film and the LOCOS oxide film.
公开/授权文献
信息查询
0/0