Invention Application
- Patent Title: Structure of TFT electrode for preventing metal layer diffusion and manufacturing method therefor
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Application No.: US11375336Application Date: 2006-03-15
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Publication No.: US20060202203A1Publication Date: 2006-09-14
- Inventor: Cheng-Chung Chen , Yu-Chang Sun , Yi-Hsun Huang , Chien-Wei Wu , Shuo-Wei Liang , Chia-Hsiang Chen , Chi-Shen Lee , Chai-Yuan Sheu , Yu-Chi Lee , Te-Ming Chu , Cheng-Hsing Chen
- Applicant: Cheng-Chung Chen , Yu-Chang Sun , Yi-Hsun Huang , Chien-Wei Wu , Shuo-Wei Liang , Chia-Hsiang Chen , Chi-Shen Lee , Chai-Yuan Sheu , Yu-Chi Lee , Te-Ming Chu , Cheng-Hsing Chen
- Priority: TW93117216 20040615
- Main IPC: H01L29/04
- IPC: H01L29/04

Abstract:
The invention provides a TFT electrode structure and its manufacturing method that can prevent metal diffusion occurring in the fabrication of a TFT, and thereby reduce the risk of contamination of the chemical vapor deposition process due to metallic ion diffusion. The transparent pixel electrode is formed after the gate electrode metal so that the pixel transparent electrode can be used as a barrier layer to prevent metal diffusion under high temperature from the gate electrode metal to adjacent insulating layers or the active layer. Further, the method used to form the transparent pixel electrode is a low-temperature physical vapor deposition process, which affected less by the processing environment, and the transparent pixel electrode is a conductive layer that is not affected by metal diffusion.
Public/Granted literature
- US07632694B2 Manufacturing method for a TFT electrode for preventing metal layer diffusion Public/Granted day:2009-12-15
Information query
IPC分类: