发明申请
US20060213763A1 Temperature control method and apparatus, and plasma processing apparatus
审中-公开
温度控制方法和装置以及等离子体处理装置
- 专利标题： Temperature control method and apparatus, and plasma processing apparatus
- 专利标题（中）： 温度控制方法和装置以及等离子体处理装置
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申请号： US11389046申请日： 2006-03-27
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公开(公告)号： US20060213763A1公开(公告)日： 2006-09-28
- 发明人: Masao Furuya , Koji Ando
- 申请人： Masao Furuya , Koji Ando
- 申请人地址： JP Minato-ku
- 专利权人： TOKYO ELECTRON LIMITED
- 当前专利权人： TOKYO ELECTRON LIMITED
- 当前专利权人地址： JP Minato-ku
- 优先权： JP2005-088984 20050325
- 主分类号： C23C14/32
- IPC分类号： C23C14/32 ; C23C14/00
摘要：
A temperature control method and apparatus, and a plasma processing apparatus are provided. The temperature control method includes the steps of, during an idle state in which a substrate processing is not performed, controlling a temperature of a heat transfer medium in a circulation channel by a second heat exchanger and a heater to control a temperature of an electrode to be maintained at a predetermined set temperature, and when a high frequency power is applied to the electrode to start the substrate processing, reducing the temperature of the heat transfer medium below the set temperature of the electrode through the use of a first heat exchanger and the second heat exchanger to maintain the temperature of the electrode at the set temperature.
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