Temperature control method and apparatus, and plasma processing apparatus
    1.
    发明申请
    Temperature control method and apparatus, and plasma processing apparatus 审中-公开
    温度控制方法和装置以及等离子体处理装置

    公开(公告)号:US20060213763A1

    公开(公告)日:2006-09-28

    申请号:US11389046

    申请日:2006-03-27

    IPC分类号: C23C14/32 C23C14/00

    CPC分类号: H01J37/32724 H01J37/32009

    摘要: A temperature control method and apparatus, and a plasma processing apparatus are provided. The temperature control method includes the steps of, during an idle state in which a substrate processing is not performed, controlling a temperature of a heat transfer medium in a circulation channel by a second heat exchanger and a heater to control a temperature of an electrode to be maintained at a predetermined set temperature, and when a high frequency power is applied to the electrode to start the substrate processing, reducing the temperature of the heat transfer medium below the set temperature of the electrode through the use of a first heat exchanger and the second heat exchanger to maintain the temperature of the electrode at the set temperature.

    摘要翻译: 提供了温度控制方法和装置以及等离子体处理装置。 温度控制方法包括以下步骤:在不执行基板处理的空闲状态下,通过第二热交换器和加热器控制循环通道中的传热介质的温度,以控制电极的温度 保持在预定的设定温度,并且当向电极施加高频功率以开始衬底处理时,通过使用第一热交换器将传热介质的温度降低到电极的设定温度以下,并且 第二热交换器将电极的温度保持在设定温度。

    Recording sheet conveying system of pressure fixing type electrostatic
printing apparatus
    2.
    发明授权
    Recording sheet conveying system of pressure fixing type electrostatic printing apparatus 失效
    压力定影型静电印刷设备的记录纸输送系统

    公开(公告)号:US4419003A

    公开(公告)日:1983-12-06

    申请号:US290563

    申请日:1981-08-06

    IPC分类号: B65H23/02 B65H23/14 G03G15/20

    摘要: An electrostatic printing apparatus of the pressure fixing type having a toner image formed on a recording sheet fixed by applying pressure, including a tension imparting device for imparting to the recording sheet a tension oriented in the direction of travel of the recording sheet and a tension oriented in a direction perpendicular to the direction of its travel, and a regulating device for regulating the angle and posture of the recording sheet located in the path of movement of the recording sheet immediately before a pressure fixing roller device. The recording sheet is kept in taut condition as it is fed to the pressure fixing roller device to enable wrinkling, jamming and skewing of the recording sheet to be avoided.

    摘要翻译: 一种压力定影型的静电印刷装置,其具有通过施加压力而形成在记录片材上的调色剂图像,该调色剂图像包括张力赋予装置,用于赋予记录片材沿着记录片材的行进方向定向的张力和张力定向 在垂直于其行进方向的方向上的调节装置,以及用于调节位于压力定影辊装置之前的记录纸的运动路径中的记录纸的角度和姿势的调节装置。 记录纸被送入压力定影辊装置时保持紧张状态,以使记录片材能起皱,卡住和歪斜以避免。

    Plasma processing apparatus, electrode temperature adjustment device and electrode temperature adjustment method
    3.
    发明授权
    Plasma processing apparatus, electrode temperature adjustment device and electrode temperature adjustment method 有权
    等离子体处理装置,电极温度调节装置和电极温度调节方法

    公开(公告)号:US08864932B2

    公开(公告)日:2014-10-21

    申请号:US12115115

    申请日:2008-05-05

    申请人: Masao Furuya

    发明人: Masao Furuya

    摘要: Before a substrate is processed in a plasma processing apparatus that inhibits an increase in the temperature of an upper electrode attributable to DC voltage application as well as an increase in the upper electrode temperature attributable to high-frequency power application, a heating medium target temperature to be achieved by a heating medium in order to adjust the upper electrode temperature to a predetermined temperature setting is calculated based upon the levels of the high-frequency power to be applied to the upper electrode and a susceptor (lower electrode) and the DC voltage to be applied to the upper electrode. During the substrate processing, the heating medium, the temperature of which is controlled based upon the target temperature, circulates through a flow passage formed at the upper electrode so as to control the temperature of the upper electrode.

    摘要翻译: 在抑制由于直流电压施加引起的上部电极的温度上升的等离子体处理装置中的基板被处理之前,以及由于高频电力施加引起的上部电极温度的升高,加热介质的目标温度 通过加热介质来实现,以便将上部电极温度调节到预定温度,基于要施加到上部电极和基座(下部电极)的高频电力的电平和将DC电压设置为 施加到上电极。 在基板处理期间,基于目标温度控制温度的加热介质通过形成在上电极的流路循环,以便控制上电极的温度。

    Processing apparatus and processing apparatus maintenance method
    4.
    发明授权
    Processing apparatus and processing apparatus maintenance method 有权
    处理装置和处理装置的维护方法

    公开(公告)号:US06993919B2

    公开(公告)日:2006-02-07

    申请号:US11075884

    申请日:2005-03-10

    IPC分类号: F25B1/00

    摘要: The electrode temperature control device in a processing apparatus 100 includes a freezing circuit 110 comprising a compressor 148, a condenser 142, an expansion valve 150 and an evaporator 108 with the evaporator disposed inside a lower electrode 106. This electrode temperature control device does not require components such as a coolant tank for storing the coolant, a pump for supplying the coolant to the processing apparatus, a heater for adjusting the temperature of the coolant and a heat exchanger for exchanging heat between a primary coolant and a secondary coolant. Thus, the production cost can be lowered, a reduction in installation area through miniaturization of the apparatus is achieved and more efficient use of energy is achieved as well. In addition, by using CO2 as the coolant, the GWP value can be reduced to approximately 1/8000 to 1/7000 that of Freon.

    摘要翻译: 处理装置100中的电极温度控制装置包括冷冻回路110,其包括压缩机148,冷凝器142,膨胀阀150和蒸发器108,蒸发器设置在下部电极106的内部。 该电极温度控制装置不需要诸如用于存储冷却剂的冷却剂罐,用于将冷却剂供应到处理装置的泵,用于调节冷却剂的温度的加热器和用于在主冷却剂之间进行热交换的热交换器 和二次冷却液。 因此,可以降低生产成本,实现通过设备的小型化减少安装面积,并且还实现更有效的能量利用。 另外,通过使用CO <2>作为冷却剂,GWP值可以降低到氟利昂的1/8000到1/7000。

    Cooling apparatus and plasma processing apparatus having cooling apparatus
    5.
    发明授权
    Cooling apparatus and plasma processing apparatus having cooling apparatus 失效
    具有冷却装置的冷却装置和等离子体处理装置

    公开(公告)号:US07000416B2

    公开(公告)日:2006-02-21

    申请号:US10432888

    申请日:2001-11-29

    摘要: a cooling apparatus 110 comprises a primary refrigerant circulating circuit which allows a primary refrigerant CW1 whose temperature is adjusted by a heat exchanger 138 to circulate through an electrode to adjust a temperature of the electrode, a secondary refrigerant circulating circuit which supplies a secondary refrigerant CW2 to the heat exchanger to adjust the temperature of the primary refrigerant, and a freezing circuit 140 which has a first heat exchanger 141 interposed in the secondary refrigerant circulating circuit and which adjust a temperature of the secondary refrigerant by a tertiary refrigerant. The temperature of the primary refrigerant is adjusted by the secondary refrigerant without adjusting the temperature using the freezing circuit. When a temperature of the primary refrigerant is set higher than that of the secondary refrigerant, the temperature of the primary refrigerant can be adjusted only by the secondary refrigerant. Only when the temperature of the primary refrigerant is set lower than that of the secondary refrigerant, the temperature of the secondary refrigerant is adjusted by the freezing circuit and thus, it is possible to save energy.

    摘要翻译: 冷却装置110包括主制冷剂循环回路,其允许温度由热交换器138调节的一次制冷剂CW 1通过电极循环以调节电极的温度;二次制冷剂循环回路,其供给二次制冷剂CW 2连接到热交换器以调节初级制冷剂的温度;以及冷冻回路140,其具有插入在二级制冷剂循环回路中的第一热交换器141,并且通过三级制冷剂来调节二级制冷剂的温度。 一次制冷剂的温度通过二次制冷剂调节,而不使用冷冻回路来调节温度。 当初级制冷剂的温度被设定为高于二次制冷剂的温度时,一次制冷剂的温度只能通过二次制冷剂进行调节。 只有当初级制冷剂的温度低于二次制冷剂的温度时,通过冷冻回路调节二次制冷剂的温度,因此能够节约能源。

    Processing apparatus and processing apparatus maintenance method
    6.
    发明申请
    Processing apparatus and processing apparatus maintenance method 有权
    处理装置和处理装置的维护方法

    公开(公告)号:US20050155373A1

    公开(公告)日:2005-07-21

    申请号:US11075884

    申请日:2005-03-10

    摘要: The electrode temperature control device in a processing apparatus 100 includes a freezing circuit 110 comprising a compressor 148, a condenser 142, an expansion valve 150 and an evaporator 108 with the evaporator disposed inside a lower electrode 106. This electrode temperature control device does not require components such as a coolant tank for storing the coolant, a pump for supplying the coolant to the processing apparatus, a heater for adjusting the temperature of the coolant and a heat exchanger for exchanging heat between a primary coolant and a secondary coolant. Thus, the production cost can be lowered, a reduction in installation area through miniaturization of the apparatus is achieved and more efficient use of energy is achieved as well. In addition, by using CO2 as the coolant, the GWP value can be reduced to approximately {fraction (1/8000)} to {fraction (1/7000)} that of Freon.

    摘要翻译: 处理装置100中的电极温度控制装置包括冷冻回路110,其包括压缩机148,冷凝器142,膨胀阀150和蒸发器108,蒸发器设置在下部电极106的内部。 该电极温度控制装置不需要诸如用于存储冷却剂的冷却剂罐,用于将冷却剂供应到处理装置的泵,用于调节冷却剂的温度的加热器和用于在主冷却剂之间进行热交换的热交换器 和二次冷却液。 因此,可以降低生产成本,实现通过设备的小型化减少安装面积,并且还实现更有效的能量利用。 此外,通过使用CO 2 2作为冷却剂,GWP值可以降低到大约{分数(1/8000至{分数(氟利昂的1/7000)。

    Processor and temperature control method therefor
    7.
    发明授权
    Processor and temperature control method therefor 有权
    处理器和温度控制方法

    公开(公告)号:US06629423B1

    公开(公告)日:2003-10-07

    申请号:US10048068

    申请日:2002-01-28

    IPC分类号: F25B4100

    摘要: A refrigerant circulating passage is provided in a bottom electrode in a processing chamber of an etching system. A refrigerant CW1 is fed from a refrigerant tank to the passage via a refrigerant supply pipe. The refrigerant is cooled in a cooler via a refrigerant pipe and is returned to the refrigerant tank. Temperature sensors provided in the refrigerant supply pipe and refrigerant discharge pipe, detect a feed temperature, an inlet temperature, an outlet temperature and a return temperature, respectively. A target differential value is derived from the heat quantity of a wafer. During processing, the temperature of the refrigerant CW1 is controlled, permitting an actual differential value between the inlet and outlet temperatures follow the target differential value which in turn permits the return temperature to follow a target return temperature which is obtained by subtracting the target differential value from a set temperature of the wafer W.

    摘要翻译: 制冷剂循环通道设置在蚀刻系统的处理室中的底部电极中。 制冷剂CW1经由制冷剂供给管从制冷剂罐供给到通路。 制冷剂通过制冷剂管在冷却器中冷却并返回到制冷剂罐。 设置在制冷剂供给管和制冷剂排出管内的温度传感器分别检测进料温度,入口温度,出口温度和回流温度。 从晶片的热量导出目标微分值。 在处理过程中,控制制冷剂CW1的温度,允许入口和出口温度之间的实际差值跟随目标差值,这进而允许返回温度跟随目标返回温度,该目标返回温度通过减去目标差值 从晶片W的设定温度