- 专利标题: Process for producing single crystal and silicon crystal wafer
- 专利标题(中): 制造单晶硅晶片的方法
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申请号: US10568186申请日: 2004-08-13
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公开(公告)号: US20060236919A1公开(公告)日: 2006-10-26
- 发明人: Izumi Fusegawa , Nobuaki Mitamuria , Takahiro Yanagimachi
- 申请人: Izumi Fusegawa , Nobuaki Mitamuria , Takahiro Yanagimachi
- 申请人地址: JP Chiyoda-ku
- 专利权人: Shin-Etsu Handotai Co., Ltd.
- 当前专利权人: Shin-Etsu Handotai Co., Ltd.
- 当前专利权人地址: JP Chiyoda-ku
- 优先权: JP2003296837 20030820
- 国际申请: PCT/JP04/11685 WO 20040813
- 主分类号: C30B23/00
- IPC分类号: C30B23/00 ; C30B25/00 ; C30B28/12 ; C30B28/14
摘要:
The present invention is a method for producing a single crystal in accordance with Czochralski method by flowing an inert gas downward in a chamber 1 of a single crystal-pulling apparatus 11 and surrounding a single crystal 3 pulled from a raw material melt 2 with a gas flow-guide cylinder 4, wherein when a single crystal within N region outside OSF region generated in a ring shape in the radial direction of the single crystal is pulled, the single crystal within N region is pulled in a condition that flow amount of the inert gas between the single crystal and the gas flow-guide cylinder is 0.6 D(L/min) or more and pressure in the chamber is 0.6 D(hPa) or less, in which D (mm) is a diameter of the single crystal to be pulled. It is preferable that there is used the gas flow-guide cylinder that Fe concentration is 0.05 ppm or less, at least, in a surface thereof. Thereby, there is provided a method for producing a single crystal, wherein in the case that a single crystal is produced by an apparatus having a gas flow-guide cylinder in accordance with CZ method, the single crystal has low defect density and Fe concentration can be suppressed to be 1×1010 atoms/cm3 or less even in a peripheral part thereof.
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