发明申请
- 专利标题: Method and apparatus for reducing substrate backside deposition during processing
- 专利标题(中): 在处理过程中减少衬底背面沉积的方法和装置
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申请号: US10549283申请日: 2004-03-17
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公开(公告)号: US20070000614A1公开(公告)日: 2007-01-04
- 发明人: Yasunori Hatamura , Kunihiko Hinata
- 申请人: Yasunori Hatamura , Kunihiko Hinata
- 申请人地址: JP Tokyo 107-8481
- 专利权人: Tokyo Electron Limited
- 当前专利权人: Tokyo Electron Limited
- 当前专利权人地址: JP Tokyo 107-8481
- 国际申请: PCT/US04/06076 WO 20040317
- 主分类号: H01L21/306
- IPC分类号: H01L21/306 ; C23C16/00
摘要:
A focus ring assembly configured to be coupled to a substrate holder comprises a focus ring and a secondary focus ring coupled to the focus ring, wherein the secondary focus ring is configured to reduce the deposition of process residue on a backside surface of the substrate.