发明申请
- 专利标题： Solder composition for electronic devices
- 专利标题（中）： 电子器件用焊料组成
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申请号： US11399856申请日： 2006-04-07
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公开(公告)号： US20070031279A1公开(公告)日： 2007-02-08
- 发明人: Tasao Soga , Hanae Shimokawa , Tetsuya Nakatsuka , Kazuma Miura , Mikio Negishi , Hirokazu Nakajima , Tsuneo Endoh
- 申请人： Tasao Soga , Hanae Shimokawa , Tetsuya Nakatsuka , Kazuma Miura , Mikio Negishi , Hirokazu Nakajima , Tsuneo Endoh
- 申请人地址： JP Tokyo
- 专利权人： Renesas Technology Corporation
- 当前专利权人： Renesas Technology Corporation
- 当前专利权人地址： JP Tokyo
- 优先权： JP2000-396905 20001225; JP2000-180719 20000612
- 主分类号： C22C9/02
- IPC分类号： C22C9/02
摘要：
Each of junctions formed between a semiconductor device and a substrate comprises metal balls of Cu, or other materials and compounds of Sn and the metal balls, and the metal balls are bonded together by the compounds.
公开/授权文献
- US08022551B2 Solder composition for electronic devices 公开/授权日：2011-09-20