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发明申请
US20070059918A1 Rigid-flexible printed circuit board for package on package and manufacturing method 审中-公开
刚性柔性印刷电路板封装及制造方法

Rigid-flexible printed circuit board for package on package and manufacturing method
摘要：
The present invention relates to a rigid-flexible multi-layer printed circuit board comprising: a flexible substrate of which circuits are formed on both sides and which is bendable; a rigid substrate which is laminated on the flexible substrate and circuits are formed on both sides and a cavity within which a semiconductor chip is mounted is formed; and a bonding sheet adhering the flexible substrate and the rigid substrate and having a insulating property. According the present invention, when the same numbers of the semiconductor chips are mounted or the POP is embodied, the whole thickness of the package can be lower. Also, two more semiconductor chips can be mounted using the space as the thickness of the core layer, and the structure impossible when the number of semiconductor chip mounted on the bottom substrate becomes two from one in conventional technology can be embodied.
摘要（中）：

硬质柔性多层印刷电路板技术领域本发明涉及一种柔性多层印刷电路板，包括：柔性基板，其两侧形成有可弯曲的电路; 层叠在柔性基板上的刚性基板和电路形成在两侧，并且形成有安装半导体芯片的空腔; 以及粘合柔性基板和刚性基板并具有绝缘性的粘合片。 根据本发明，当安装相同数量的半导体芯片或实施POP时，封装的整体厚度可以较低。 此外，可以使用空间作为芯层的厚度来安装另外两个半导体芯片，并且可以实现当传统技术中安装在底部基板上的半导体芯片的数量变为二倍时的结构不可行。

信息查询
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IPC分类:
H 电学
H01 基本电气元件
H01L 半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00 专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/02 .半导体器件或其部件的制造或处理
H01L21/04 ..至少具有一个跃变势垒或表面势垒的器件，例如PN结、耗尽层、载体集结层
H01L21/34 ...具有H01L21/06，H01L21/16及H01L21/18各组不包含的或有或无杂质，例如掺杂材料的半导体的器件
H01L21/46 ....用H01L21/36至H01L21/428各组不包含的方法或设备处理半导体材料的（在半导体材料上制作电极的入H01L21/44）
H01L21/461 .....改变半导体材料的表面物理特性或形状的，例如腐蚀、抛光、切割
H01L21/4763 ......非绝缘层的沉积，例如绝缘层上的导电层、电阻层；这些层的后处理（电极的制造入H01L21/28）
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