发明申请
- 专利标题： SOLDER BUMP STRUCTURE FOR FLIP CHIP SEMICONDUCTOR DEVICES AND METHOD OF MANUFACTURE THEREFORE
- 专利标题（中）： 片状半导体器件的焊接结构及其制造方法
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申请号： US11459249申请日： 2006-07-21
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公开(公告)号： US20070069394A1公开(公告)日： 2007-03-29
- 发明人: Mark Bachman , Donald Bitting , Sailesh Chittipeddi , Seung Kang , Sailesh Merchant
- 申请人： Mark Bachman , Donald Bitting , Sailesh Chittipeddi , Seung Kang , Sailesh Merchant
- 申请人地址： US PA Allentown
- 专利权人： Agere Systems Inc.
- 当前专利权人： Agere Systems Inc.
- 当前专利权人地址： US PA Allentown
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
The invention provides, in one aspect, a semiconductor device that comprises an interconnect layer located over a semiconductor substrate. A passivation layer is located over the interconnect layer and having a solder bump support opening formed therein. Support pillars that comprise a conductive material are located within the solder bump support opening.
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