发明申请
- 专利标题： Electroless copper plating solution, electroless copper plating process and production process of circuit board
- 专利标题（中）： 化学镀铜液，化学镀铜工艺及电路板生产工艺
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申请号： US11634071申请日： 2006-12-06
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公开(公告)号： US20070079727A1公开(公告)日： 2007-04-12
- 发明人: Takeyuki Itabashi , Hiroshi Kanemoto , Haruo Akahoshi , Eiji Takai , Naoki Nishimura , Tadashi Iida , Yoshinori Ueda
- 申请人： Takeyuki Itabashi , Hiroshi Kanemoto , Haruo Akahoshi , Eiji Takai , Naoki Nishimura , Tadashi Iida , Yoshinori Ueda
- 优先权： JP2001-048685 20010223
- 主分类号： C23C18/40
- IPC分类号： C23C18/40 ; B05D1/40
摘要：
This invention provides an electroless copper plating solution using glyoxylic acid as a reducing agent, which is small in the reacting quantity of Cannizzaro reaction, does not largely cause precipitation of the salt accumulated in the electroless copper plating solution by the plating reaction and Cannizzaro reaction, and can be used stably over a long period of time. The electroless copper plating solution comprises copper ion, a complexing agent for copper ion, a reducing agent for copper ion and a pH adjusting agent, wherein said reducing agent for copper ion is glyoxylic acid or a salt thereof, said pH adjusting agent is potassium hydroxide and said electroless copper plating solution contains at least one member selected from metasilicic acid, metasilicic acid salt, germanium dioxide, germanic acid salt, phosphoric acid, phosphoric acid salt, vanadic acid, vanadic acid salt, stannic acid and stannic acid salt in an amount of 0.0001 mol/L or more.