公开(公告)号：US20070079727A1

公开(公告)日：2007-04-12

申请号：US11634071

申请日：2006-12-06

申请人： Takeyuki Itabashi ,  Hiroshi Kanemoto ,  Haruo Akahoshi ,  Eiji Takai ,  Naoki Nishimura ,  Tadashi Iida ,  Yoshinori Ueda

发明人： Takeyuki Itabashi ,  Hiroshi Kanemoto ,  Haruo Akahoshi ,  Eiji Takai ,  Naoki Nishimura ,  Tadashi Iida ,  Yoshinori Ueda

IPC分类号： C23C18/40 ,  B05D1/40

CPC分类号： C23C18/1803 ,  C23C18/1653 ,  C23C18/40

摘要： This invention provides an electroless copper plating solution using glyoxylic acid as a reducing agent, which is small in the reacting quantity of Cannizzaro reaction, does not largely cause precipitation of the salt accumulated in the electroless copper plating solution by the plating reaction and Cannizzaro reaction, and can be used stably over a long period of time. The electroless copper plating solution comprises copper ion, a complexing agent for copper ion, a reducing agent for copper ion and a pH adjusting agent, wherein said reducing agent for copper ion is glyoxylic acid or a salt thereof, said pH adjusting agent is potassium hydroxide and said electroless copper plating solution contains at least one member selected from metasilicic acid, metasilicic acid salt, germanium dioxide, germanic acid salt, phosphoric acid, phosphoric acid salt, vanadic acid, vanadic acid salt, stannic acid and stannic acid salt in an amount of 0.0001 mol/L or more.

摘要翻译： 本发明提供一种使用乙醛酸作为还原剂的化学镀铜溶液，其在坎尼扎罗反应的反应量较小时，不会通过电镀反应和坎尼扎罗反应在很大程度上导致积存在化学镀铜溶液中的盐沉淀， 并可长期稳定使用。 所述无电镀铜溶液包括铜离子，铜离子络合剂，铜离子还原剂和pH调节剂，其中所述铜离子还原剂是乙醛酸或其盐，所述pH调节剂是氢氧化钾 所述化学镀铜溶液含有选自硅酸，偏硅酸盐，二氧化锗，锗酸盐，磷酸，磷酸盐，钒酸，钒酸盐，锡酸和锡酸盐中的至少一种， 为0.0001mol / L以上。

公开(公告)号：US07169216B2

公开(公告)日：2007-01-30

申请号：US10898282

申请日：2004-07-26

申请人： Takeyuki Itabashi ,  Hiroshi Kanemoto ,  Haruo Akahoshi ,  Eiji Takai ,  Naoki Nishimura ,  Tadashi Iida ,  Yoshinori Ueda

发明人： Takeyuki Itabashi ,  Hiroshi Kanemoto ,  Haruo Akahoshi ,  Eiji Takai ,  Naoki Nishimura ,  Tadashi Iida ,  Yoshinori Ueda

IPC分类号： C23C18/40

CPC分类号： C23C18/1803 ,  C23C18/1653 ,  C23C18/40

摘要： An electroless copper plating solution using glyoxylic acid as a reducing agent, which is small in the reacting quantity of Cannizzaro reaction, does not largely cause precipitation of the salt accumulated in the electroless copper plating solution by the plating reaction and Cannizzaro reaction, and can be used stably over a long period of time. The electroless copper plating solution comprises copper ion, a complexing agent for copper ion, a reducing agent for copper ion and a pH adjusting agent, wherein the reducing agent for copper ion is glyoxylic acid or a salt thereof, the pH adjusting agent is potassium hydroxide and the electroless copper plating solution contains at least one member selected from metasilicic acid, metasilicic acid salt, germanium dioxide, germanic acid salt, phosphoric acid, phosphoric acid salt, vanadic acid, vanadic acid salt, stannic acid and stannic acid salt in an amount of 0.0001 mol/L or more.

摘要翻译： 使用乙醛酸作为还原剂的化学镀铜溶液，其在Cannizzaro反应的反应量较小时，不会通过电镀反应和Cannizzaro反应极大地引起积存在无电镀铜溶液中的盐的沉淀，并且可以 长时间稳定使用。 无电镀铜液包括铜离子，铜离子络合剂，铜离子还原剂和pH调节剂，其中铜离子还原剂为乙醛酸或其盐，pH调节剂为氢氧化钾 化学镀铜溶液含有选自硅酸，偏硅酸盐，二氧化锗，锗酸盐，磷酸，磷酸盐，钒酸，钒酸盐，锡酸和锡酸盐中的至少一种， 为0.0001mol / L以上。

公开(公告)号：US20050079280A1

公开(公告)日：2005-04-14

申请号：US10898282

申请日：2004-07-26

申请人： Takeyuki Itabashi ,  Hiroshi Kanemoto ,  Haruo Akahoshi ,  Eiji Takai ,  Naoki Nishimura ,  Tadashi Iida ,  Yoshinori Ueda

发明人： Takeyuki Itabashi ,  Hiroshi Kanemoto ,  Haruo Akahoshi ,  Eiji Takai ,  Naoki Nishimura ,  Tadashi Iida ,  Yoshinori Ueda

IPC分类号： C23C18/40 ,  C23C28/02 ,  C25D7/00 ,  H05K3/18 ,  C23C16/00

CPC分类号： C23C18/1803 ,  C23C18/1653 ,  C23C18/40

摘要： An electroless copper plating solution using glyoxylic acid as a reducing agent, which is small in the reacting quantity of Cannizzaro reaction, does not largely cause precipitation of the salt accumulated in the electroless copper plating solution by the plating reaction and Cannizzaro reaction, and can be used stably over a long period of time. The electroless copper plating solution comprises copper ion, a complexing agent for copper ion, a reducing agent for copper ion and a pH adjusting agent, wherein the reducing agent for copper ion is glyoxylic acid or a salt thereof, the pH adjusting agent is potassium hydroxide and the electroless copper plating solution contains at least one member selected from metasilicic acid, metasilicic acid salt, germanium dioxide, germanic acid salt, phosphoric acid, phosphoric acid salt, vanadic acid, vanadic acid salt, stannic acid and stannic acid salt in an amount of 0.0001 mol/L or more.

摘要翻译： 使用乙醛酸作为还原剂的化学镀铜溶液，其在Cannizzaro反应的反应量较小时，不会通过电镀反应和Cannizzaro反应极大地引起积存在无电镀铜溶液中的盐的沉淀，并且可以 长时间稳定使用。 无电镀铜液包括铜离子，铜离子络合剂，铜离子还原剂和pH调节剂，其中铜离子还原剂为乙醛酸或其盐，pH调节剂为氢氧化钾 化学镀铜溶液含有选自硅酸，偏硅酸盐，二氧化锗，锗酸盐，磷酸，磷酸盐，钒酸，钒酸盐，锡酸和锡酸盐中的至少一种， 为0.0001mol / L以上。

公开(公告)号：US06805915B2

公开(公告)日：2004-10-19

申请号：US10076536

申请日：2002-02-19

申请人： Takeyuki Itabashi ,  Hiroshi Kanemoto ,  Haruo Akahoshi ,  Eiji Takai ,  Naoki Nishimura ,  Tadashi Iida ,  Yoshinori Ueda

发明人： Takeyuki Itabashi ,  Hiroshi Kanemoto ,  Haruo Akahoshi ,  Eiji Takai ,  Naoki Nishimura ,  Tadashi Iida ,  Yoshinori Ueda

IPC分类号： B05D118

CPC分类号： C23C18/1803 ,  C23C18/1653 ,  C23C18/40

摘要： An electroless copper plating solution using glyoxylic acid as a reducing agent, which is small in the reacting quantity of Cannizzaro reaction, does not largely cause precipitation of the salt accumulated in the electroless copper plating solution by the plating reaction and Cannizzaro reaction, and can be used stably over a long period of time. The electroless copper plating solution comprises copper ion, a complexing agent for copper ion, a reducing agent for copper ion and a pH adjusting agent, wherein the reducing agent for copper ion is glyoxylic acid or a salt thereof, the pH adjusting agent is potassium hydroxide and the electroless copper plating solution contains at least one member selected from metasilicic acid, metasilicic acid salt, germanium dioxide, germanic acid salt, phosphoric acid, phosphoric acid salt, vanadic acid, vanadic acid salt, stannic acid and stannic acid salt in an amount of 0.0001 mol/L or more.

摘要翻译： 使用乙醛酸作为还原剂的化学镀铜溶液，其在Cannizzaro反应的反应量较小时，不会通过电镀反应和Cannizzaro反应极大地引起积存在无电镀铜溶液中的盐的沉淀，并且可以 长时间稳定使用。 无电镀铜液包括铜离子，铜离子络合剂，铜离子还原剂和pH调节剂，其中铜离子还原剂为乙醛酸或其盐，pH调节剂为氢氧化钾 化学镀铜溶液含有选自硅酸，偏硅酸盐，二氧化锗，锗酸盐，磷酸，磷酸盐，钒酸，钒酸盐，锡酸和锡酸盐中的至少一种， 为0.0001mol / L以上。

公开(公告)号：US06900394B1

公开(公告)日：2005-05-31

申请号：US09678800

申请日：2000-10-04

申请人： Takeyuki Itabashi ,  Haruo Akahoshi ,  Tadashi Iida ,  Yoshinori Ueda ,  Eiji Takai ,  Naoki Nishimura

发明人： Takeyuki Itabashi ,  Haruo Akahoshi ,  Tadashi Iida ,  Yoshinori Ueda ,  Eiji Takai ,  Naoki Nishimura

IPC分类号： H05K3/46 ,  C23C18/16 ,  C23C18/31 ,  C23C18/40 ,  H05K3/18 ,  H01R12/04 ,  H05K1/11

CPC分类号： C23C18/1617 ,  C23C18/40 ,  H05K3/187

摘要： A method is provided for removing plating blocking ions, such as anions, in pairs with copper ions and oxidant ions of a copper ion reducing agent from an electroless copper plating solution and keeping a constant salt concentration in the electroless copper plating solution during plating. The electroless copper plating method uses a plating solution containing copper sulfate as copper ion sources, and a copper ion complexing agent as copper ion sources, glyoxylic acid as a copper ion reducing agent, and a pH conditioner. The method is characterized by precipitating and removing sulfuric and oxalic ions in said electroless copper plating solution and keeping an optimum concentration of at least one of sulfuric and oxalic ions in said electroless copper plating solution during plating.

摘要翻译： 提供了一种从电化学镀铜溶液中去除铜离子还原剂的铜离子和氧化剂离子的电镀阻挡离子（例如阴离子）的方法，并且在镀覆期间在化学镀铜溶液中保持恒定的盐浓度。 无电镀铜方法使用含有硫酸铜作为铜离子源的镀液，铜离子源铜离子络合剂，作为铜离子还原剂的乙醛酸和pH调节剂。 该方法的特征在于在所述化学镀铜溶液中析出和除去硫酸和草酸离子，并且在镀覆期间保持所述无电镀铜溶液中的硫酸和草酸离子中的至少一种的最佳浓度。

公开(公告)号：US20050042366A1

公开(公告)日：2005-02-24

申请号：US10959073

申请日：2004-10-07

申请人： Takeyuki Itabashi ,  Haruo Akahoshi ,  Eiji Takai ,  Naoki Nishimura ,  Tadashi Iida ,  Yoshinori Ueda

发明人： Takeyuki Itabashi ,  Haruo Akahoshi ,  Eiji Takai ,  Naoki Nishimura ,  Tadashi Iida ,  Yoshinori Ueda

IPC分类号： H05K1/02 ,  C23C18/38 ,  C23C18/40 ,  H05K3/18 ,  H05K3/42 ,  H05K3/46 ,  B05D1/18

CPC分类号： C23C18/40 ,  H05K3/421 ,  H05K3/422 ,  H05K3/426 ,  H05K3/429 ,  H05K2201/09518

摘要： A multilayer wiring substrate which is high in connection reliability is provided through process steps of forming more than one opening, such as a via-hole in a dielectric layer laminated on a substrate, and then applying uniform copper plating to a surface portion of the dielectric layer including the opening to thereby form a wiring layer. An electroless copper plating solution with at least one of mandelonitrile and triethyltetramine mixed therein is used to perform the intended electroless copper plating. An alternative process makes use of an electroless copper plating solution with chosen additives or “admixtures” containing at least on of mandelonitrile and triethyltetramine plus eriochrome block T along with at least one of 2,2′-bipyridyl, 1,10-phenanthroline, and 2,9-dimethyl-1,10-phenanthroline

摘要翻译： 通过在层叠在基板上的电介质层中形成多个开口（例如通孔），然后对电介质的表面部分施加均匀的镀铜，通过工艺步骤提供连接可靠性高的多层布线基板 层，从而形成布线层。 使用其中混合有扁桃腈和三乙基四胺中的至少一种的无电镀铜溶液进行预期的无电镀铜。 一种替代方法利用含有至少含有扁桃腈和三乙基四胺加色团块T的选择的添加剂或“混合物”的化学镀铜溶液以及至少一种2,2'-联吡啶，1,10-菲咯啉和 2,9-二甲基-1,10-菲咯啉

公开(公告)号：US06831009B2

公开(公告)日：2004-12-14

申请号：US09962249

申请日：2001-09-26

申请人： Takeyuki Itabashi ,  Haruo Akahoshi ,  Eiji Takai ,  Naoki Nishimura ,  Tadashi Iida ,  Yoshinori Ueda

发明人： Takeyuki Itabashi ,  Haruo Akahoshi ,  Eiji Takai ,  Naoki Nishimura ,  Tadashi Iida ,  Yoshinori Ueda

IPC分类号： H01L214763

CPC分类号： C23C18/40 ,  H05K3/421 ,  H05K3/422 ,  H05K3/426 ,  H05K3/429 ,  H05K2201/09518

摘要： A multilayer wiring substrate which is high in connection reliability is provided through process steps of forming more than one opening, such as a via-hole in a dielectric layer laminated on a substrate, and then applying uniform copper plating to a surface portion of the dielectric layer including the opening to thereby form a wiring layer. An electroless copper plating solution with at least one of mandelonitrile and triethyltetramine mixed therein is used to perform the intended electroless copper plating. An alternative process makes use of a electroless copper plating solution with chosen additive agents or “admixtures” containing at least one of mandelonitrile and triethyltetramine plus eriochrome black T along with at least one of 2,2′-bipyridyl, 1,10-phenanthroline, and 2,9-dimethyl-1,10-phenanthroline.

摘要翻译： 通过在层叠在基板上的电介质层中形成多个开口（例如通孔），然后对电介质的表面部分施加均匀的镀铜，通过工艺步骤提供连接可靠性高的多层布线基板 层，从而形成布线层。 使用其中混合有扁桃腈和三乙基四胺中的至少一种的无电镀铜溶液进行预期的无电镀铜。 一种替代方法利用具有选择的添加剂的无电镀铜溶液或含有扁桃腈和三乙基四胺加上色素黑T中的至少一种的“混合物”以及2,2'-联吡啶，1,10-菲咯啉， 和2,9-二甲基-1,10-菲咯啉。

公开(公告)号：US06989329B2

公开(公告)日：2006-01-24

申请号：US10959073

申请日：2004-10-07

申请人： Takeyuki Itabashi ,  Haruo Akahoshi ,  Eiji Takai ,  Naoki Nishimura ,  Tadashi Iida ,  Yoshinori Ueda

发明人： Takeyuki Itabashi ,  Haruo Akahoshi ,  Eiji Takai ,  Naoki Nishimura ,  Tadashi Iida ,  Yoshinori Ueda

IPC分类号： H01L21/44

CPC分类号： C23C18/40 ,  H05K3/421 ,  H05K3/422 ,  H05K3/426 ,  H05K3/429 ,  H05K2201/09518

摘要： A multilayer wiring substrate which is high in connection reliability is provided through process steps of forming more than one opening, such as a via-hole in a dielectric layer laminated on a substrate, and then applying uniform copper plating to a surface portion of the dielectric layer including the opening to thereby form a wiring layer. An electroless copper plating solution with at least one of mandelonitrile and triethyltetramine mixed therein is used to perform the intended electroless copper plating. An alternative process makes use of an electroless copper plating solution with chosen additives or “admixtures” containing at least on of mandelonitrile and triethyltetramine plus eriochrome block T along with at least one of 2,2′-bipyridyl, 1,10-phenanthroline, and 2,9-dimethyl-1,10-phenanthroline

摘要翻译： 通过在层叠在基板上的电介质层中形成多个开口（例如通孔），然后对电介质的表面部分施加均匀的镀铜，通过工艺步骤提供连接可靠性高的多层布线基板 层，从而形成布线层。 使用其中混合有扁桃腈和三乙基四胺中的至少一种的无电镀铜溶液进行预期的无电镀铜。 一种替代方法利用含有至少含有扁桃腈和三乙基四胺加色团块T的选择的添加剂或“混合物”的化学镀铜溶液以及至少一种2,2'-联吡啶，1,10-菲咯啉和 2,9-二甲基-1,10-菲咯啉

公开(公告)号：US20050252684A1

公开(公告)日：2005-11-17

申请号：US11113011

申请日：2005-04-25

申请人： Takeyiki Itabashi ,  Haruo Akahoshi ,  Tadashi Iida ,  Yoshinori Ueda ,  Eiji Takai ,  Naoki Nishimura

发明人： Takeyiki Itabashi ,  Haruo Akahoshi ,  Tadashi Iida ,  Yoshinori Ueda ,  Eiji Takai ,  Naoki Nishimura

IPC分类号： H05K3/46 ,  C23C18/16 ,  C23C18/31 ,  C23C18/40 ,  H05K3/18 ,  H05K1/11 ,  B05D3/04 ,  B05D3/10 ,  H01R12/04

CPC分类号： C23C18/1617 ,  C23C18/40 ,  H05K3/187

摘要： A method is provided for removing plating blocking ions, such as anions, in pairs with copper ions and oxidant ions of a copper ion reducing agent from an electroless copper plating solution and keeping a constant salt concentration in the electroless copper plating solution during plating. The electroless copper plating method uses a plating solution containing copper sulfate as copper ion sources, and a copper ion complexing agent as copper ion sources, glyoxylic acid as a copper ion reducing agent, and a pH conditioner. The method is characterized by precipitating and removing sulfuric and oxalic ions in said electroless copper plating solution and keeping an optimum concentration of at least one of sulfuric and oxalic ions in said electroless copper plating solution during plating.

摘要翻译： 提供了一种从电化学镀铜溶液中去除铜离子还原剂的铜离子和氧化剂离子的电镀阻挡离子（例如阴离子）的方法，并且在镀覆期间在化学镀铜溶液中保持恒定的盐浓度。 无电镀铜方法使用含有硫酸铜作为铜离子源的镀液，铜离子源铜离子络合剂，作为铜离子还原剂的乙醛酸和pH调节剂。 该方法的特征在于在所述化学镀铜溶液中析出和除去硫酸和草酸离子，并且在镀覆期间保持所述无电镀铜溶液中的硫酸和草酸离子中的至少一种的最佳浓度。

公开(公告)号：US08417407B2

公开(公告)日：2013-04-09

申请号：US13254903

申请日：2009-10-01

申请人： Naoki Nishimura

发明人： Naoki Nishimura

IPC分类号： G05D29/00

CPC分类号： B60W20/10 ,  B60K1/02 ,  B60K6/365 ,  B60K6/445 ,  B60L2240/423 ,  B60W10/06 ,  B60W10/08 ,  B60W10/26 ,  B60W20/00 ,  B60W2510/244 ,  B60W2520/10 ,  B60W2540/10 ,  B60W2710/0644 ,  B60W2710/0666 ,  B60W2710/083 ,  F02D29/02 ,  F02N11/0818 ,  F02N11/0833 ,  F02N2200/061 ,  F02N2200/106 ,  Y02T10/48 ,  Y02T10/6239 ,  Y02T10/6286 ,  Y02T10/642

摘要： A vehicular electric power source control device provided on a vehicle provided with an engine that may be stopped even in a vehicle drivable state which is established when a predetermined condition is satisfied and in which a vehicle drive force can be generated, and an electric-energy storage device which is charged by an operation of said engine, the vehicular electric power source control device permitting implementation of an automatic engine starting control to start said engine when an amount of an electric energy stored in said electric-energy storage device has been reduced to or below a predetermined charging start threshold value while the engine is held at rest in said vehicle drivable state, the vehicle electric power source control device includes an engine start permitting portion configured to permit the implementation of said automatic engine starting control under a condition that any passenger is present within the vehicle.

摘要翻译： 一种设置在车辆上的车辆电源控制装置，该车辆设置有即使在满足预定条件并且可以产生车辆驱动力的情况下建立的车辆可驱动状态下也可能停止的发动机，并且电能 存储装置，其通过所述发动机的操作而被充电，所述车辆电源控制装置允许执行自动发动机起动控制以在存储在所述电能存储装置中的电能量已经减少到 或低于预定的充电开始阈值，同时发动机在所述车辆可驱动状态下保持静止时，车辆电源控制装置包括发动机起动允许部分，其被配置为允许在任何 乘客在车内。