发明申请
US20070128371A1 Method and use of a device for applying coatings to band-like structures during the production of semiconductor components
有权
在制造半导体部件期间用于将涂层施加到带状结构的装置的方法和用途
- 专利标题： Method and use of a device for applying coatings to band-like structures during the production of semiconductor components
- 专利标题（中）： 在制造半导体部件期间用于将涂层施加到带状结构的装置的方法和用途
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申请号： US11549366申请日： 2006-10-13
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公开(公告)号： US20070128371A1公开(公告)日： 2007-06-07
- 发明人: Bernd Betz , Joachim Mahler , Ralf Otremba , Stefan Paulus
- 申请人： Bernd Betz , Joachim Mahler , Ralf Otremba , Stefan Paulus
- 优先权： DE102004018483.6 20040414
- 主分类号： B05D5/12
- IPC分类号： B05D5/12 ; B05D5/00 ; B05D7/00
摘要：
In a device (35) and a method a thin organic or inorganic layer is applied to individual component positions of band-like structures (1). The layer can effect improved or optimized adhesion between a coated surface and a plastic housing compound. Furthermore, the layer can be used as a corrosion prevention layer, an electrical insulating layer or as a dielectric for the coated surfaces. For the selective application of the layer, the device (35) has a jet printer (2) having a plurality of electronically controllable jet heads (4-7). The jet printer (2) coats the band-like structures (1) selectively on the upper side (17) in a first coating position (15) and coats the band-like structures (1) selectively on the underside (18) in a second coating position (16).
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