发明申请
US20070145606A1 Semiconductor Device with Semiconductor Device Components Embedded in a Plastic Housing Composition
有权
具有嵌入在塑料外壳组合物中的半导体器件部件的半导体器件
- 专利标题： Semiconductor Device with Semiconductor Device Components Embedded in a Plastic Housing Composition
- 专利标题（中）： 具有嵌入在塑料外壳组合物中的半导体器件部件的半导体器件
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申请号： US11612738申请日： 2006-12-19
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公开(公告)号： US20070145606A1公开(公告)日： 2007-06-28
- 发明人: Joachim Mahler , Ralf Wombacher , Dieter Lachman , Bernd Betz , Stefan Paulus , Edmund Riedl
- 申请人： Joachim Mahler , Ralf Wombacher , Dieter Lachman , Bernd Betz , Stefan Paulus , Edmund Riedl
- 申请人地址： DE Munich 81669
- 专利权人： INFINEON TECHNOLOGIES AG
- 当前专利权人： INFINEON TECHNOLOGIES AG
- 当前专利权人地址： DE Munich 81669
- 优先权： DE102005061248.2 20051220
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
A semiconductor device includes semiconductor device components, an adhesion promoter structure and a plastic housing composition. The semiconductor device components are embedded in the plastic housing composition with the adhesion promoter structure being disposed between the device components and the housing composition. The adhesion promoter structure includes first and second adhesion promoter layers. The first layer includes metal oxides. The metal oxides being silicates of a reactive compound composed of oxygen and organometallic molecules. The second layer includes at least one polymer.
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