Invention Application
- Patent Title: METHOD FOR FABRICATING IDENTIFICATION CODE
- Patent Title (中): 制作识别码的方法
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Application No.: US11467568Application Date: 2006-08-28
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Publication No.: US20070220742A1Publication Date: 2007-09-27
- Inventor: Kuang-Lin Lo , Yung-Hui Wang
- Applicant: Kuang-Lin Lo , Yung-Hui Wang
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Priority: TW95110225 20060324
- Main IPC: H01R43/00
- IPC: H01R43/00 ; G08B13/14 ; G06K7/00
Abstract:
A method for fabricating an identification code is provided. First, a metallic film is provided for fabricating a circuit on a substrate, and a circuit area and a non-circuit area are formed on the metallic film after a patterning process. Next, an identification code is formed on the non-circuit area for the basis of production management and quality control.
Information query
