发明申请
- 专利标题： Wiring board, production process thereof and connection method using same
- 专利标题（中）： 接线板及其生产工艺及其连接方法
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申请号： US11408373申请日： 2006-04-21
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公开(公告)号： US20070246158A1公开(公告)日： 2007-10-25
- 发明人: Hideo Yamazaki , Yoshiyuki Ohkura , Nathan Kreutter , Shoji Takeuchi
- 申请人： Hideo Yamazaki , Yoshiyuki Ohkura , Nathan Kreutter , Shoji Takeuchi
- 专利权人： 3M Innovative Properties Company
- 当前专利权人： 3M Innovative Properties Company
- 主分类号： B32B3/00
- IPC分类号： B32B3/00
摘要：
The present invention provides a wiring board capable of realizing electrical connectivity even with connection leads having a fine pitch of 100 μm or less. The present invention relates to a wiring board with adhesive film comprising: a wiring board, in which the surface of a connection terminal portion on the end of a connection lead on the wiring board has a non-flat shape formed by a plating method; and, an adhesive film that covers the surface of the connection terminal portion and contains either a thermoplastic resin or a thermoplastic, thermosetting resin.