A semiconductor wafer processing apparatus may include a chuck and/or a focus ring. The chuck may be configured to hold a wafer. The focus ring may be disposed surrounding a rim of the chuck. The focus ring may include a first section formed of a first material and a second section formed of a second material. The first material and the second material may have different conductivities. A method of forming a semiconductor wafer processing apparatus may include forming a first section of a focus ring from a first material, forming a second section of the focus ring from a second material having a different conductivity than the first material, combining the first and second sections to form a focus ring, and/or arranging the focus ring so as to surround a chuck.