Invention Application
- Patent Title: DUAL-SIDED CHIP ATTACHED MODULES
- Patent Title (中): 双面芯片连接模块
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Application No.: US11383595Application Date: 2006-05-16
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Publication No.: US20070267746A1Publication Date: 2007-11-22
- Inventor: Kerry Bernstein , Timothy Dalton , Timothy Harrison Daubenspeck , Jeffrey Peter Gambino , Mark David Jaffe , Christopher David Muzzy , Wolfgang Sauter , Edmund Sprogis , Anthony Kendall Stamper
- Applicant: Kerry Bernstein , Timothy Dalton , Timothy Harrison Daubenspeck , Jeffrey Peter Gambino , Mark David Jaffe , Christopher David Muzzy , Wolfgang Sauter , Edmund Sprogis , Anthony Kendall Stamper
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52
Abstract:
An electronic device and method of packaging an electronic device. The device including: a first substrate, a second substrate and an integrated circuit chip having a first side and an opposite second side, a first set of chip pads on the first side and a second set of chip pads on the second side of the integrated circuit chip, chip pads of the first set of chip pads physically and electrically connected to corresponding substrate pads on the first substrate and chip pads of the second set of chip pads physically and electrically connected to substrate pads of the substrate.
Public/Granted literature
- US07462509B2 Dual-sided chip attached modules Public/Granted day:2008-12-09
Information query
IPC分类:
