Invention Application
- Patent Title: SELECTIVE METAL SURFACE TREATMENT PROCESS AND APPARATUS FOR CIRCUIT BOARD AND RESIST USED IN THE PROCESS
- Patent Title (中): 选择性金属表面处理工艺和电路板的使用方法
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Application No.: US11456213Application Date: 2006-07-10
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Publication No.: US20070281388A1Publication Date: 2007-12-06
- Inventor: Cheng-Po Yu , Cheng-Hung Yu , Chi-Min Chang
- Applicant: Cheng-Po Yu , Cheng-Hung Yu , Chi-Min Chang
- Applicant Address: TW Taoyuan
- Assignee: UNIMICRON TECHNOLOGY CORP.
- Current Assignee: UNIMICRON TECHNOLOGY CORP.
- Current Assignee Address: TW Taoyuan
- Priority: TW95119341 20060601
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/4763
Abstract:
A selective metal surface treatment process of a circuit board, which has a solder mask and a multiple of selective metal treatment surface areas, wherein the solder mask covers the surface of the circuit board but exposes the selective metal surface treatment areas, is provided. The selective metal surface treatment process includes using a printhead to selectively print a resist on a selective metal surface treatment area, performing a surface treatment of the other selective metal surface treatment areas, and removing the resist. A selective metal surface treatment apparatus used for performing the selective metal surface treatment process of the circuit board is also provided. Through the present invention, unnecessary waste of the materials in the process is reduced and the processing time is shortened.
Information query
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