Invention Application
- Patent Title: Optical printed circuit board and fabricating method thereof
- Patent Title (中): 光学印刷电路板及其制造方法
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Application No.: US11889327Application Date: 2007-08-10
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Publication No.: US20080037929A1Publication Date: 2008-02-14
- Inventor: Joon-Sung Kim , Je-Gwang Yoo , Han-Seo Cho , Sang-Hoon Kim
- Applicant: Joon-Sung Kim , Je-Gwang Yoo , Han-Seo Cho , Sang-Hoon Kim
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2006-0076807 20060814
- Main IPC: G02B6/13
- IPC: G02B6/13

Abstract:
An optical printed circuit board which can transfer optical signal and electric signals simultaneously, and a method of fabricating the optical printed circuit board. An optical printed circuit board which includes an upper cladding layer, a core layer positioned in the upper cladding layer that has a first reflecting surface and a second reflecting surface at both ends to guide optical signals, a lower cladding layer of which one side is in contact with the upper cladding layer and which has a circuit pattern and light connecting bumps on the other side corresponding to the first reflecting surface and the second reflecting surface, may provide the advantage of high optical connection efficiency.
Public/Granted literature
- US07529439B2 Optical printed circuit board and fabricating method thereof Public/Granted day:2009-05-05
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