发明申请
US20080051313A1 COMPOSITION FOR REMOVING A POLYMERIC CONTAMINANT AND METHOD OF REMOVING A POLYMERIC CONTAMINANT USING THE SAME
有权
用于除去聚合物污染物的组合物及其使用该聚合物的聚合物污染物的方法
- 专利标题： COMPOSITION FOR REMOVING A POLYMERIC CONTAMINANT AND METHOD OF REMOVING A POLYMERIC CONTAMINANT USING THE SAME
- 专利标题（中）： 用于除去聚合物污染物的组合物及其使用该聚合物的聚合物污染物的方法
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申请号： US11840165申请日： 2007-08-16
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公开(公告)号： US20080051313A1公开(公告)日： 2008-02-28
- 发明人: Sang-Mi Lee , Kwang-Shin Lim , Jung-Dae Park , Tae-Hyo Choi
- 申请人： Sang-Mi Lee , Kwang-Shin Lim , Jung-Dae Park , Tae-Hyo Choi
- 申请人地址： KR Gyeonggi-do
- 专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址： KR Gyeonggi-do
- 优先权： KR2006-0080382 20060824
- 主分类号： C11D3/20
- IPC分类号： C11D3/20
摘要：
In a composition for removing a polymeric contaminant that may remain on an apparatus for manufacturing a semiconductor device and a method of removing a polymeric contaminant using the composition, the composition includes from about 5 to 10 percent by weight of a fluoride salt, from about 5 to 15 percent by weight of an acid or a salt thereof, and from about 75 to 90 percent by weight of an aqueous solution of glycol. The composition can effectively remove the polymeric contaminant from the apparatus within a relatively short period of time, and suppress damages to parts of the apparatus.
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