发明申请
- 专利标题： MEMS device and assembly method
- 专利标题（中）： MEMS器件和组装方法
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申请号： US11519204申请日： 2006-09-12
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公开(公告)号： US20080063830A1公开(公告)日： 2008-03-13
- 发明人: Jan Bex , Raymond Jacobus Knaapen , Gerard Johannes Pieter Nijsse , Gerard Kums
- 申请人： Jan Bex , Raymond Jacobus Knaapen , Gerard Johannes Pieter Nijsse , Gerard Kums
- 申请人地址： NL Veldhoven
- 专利权人： ASML Netherlands B.V.
- 当前专利权人： ASML Netherlands B.V.
- 当前专利权人地址： NL Veldhoven
- 主分类号： B32B37/12
- IPC分类号： B32B37/12 ; B32B41/00 ; B32B3/26
摘要：
A method of bonding a MEMS device to a substrate to form a MEMS device assembly. A thickness profile of the MEMS device and/or the flatness of the mating surface of the substrate is determined. An adhesive is deposited onto a mating surface of the MEMS device and/or the mating surface of the substrate. The mating surfaces of the MEMS device and substrate are brought together, such that the adhesive can bond the MEMS device to the substrate. The volume of adhesive deposited at particular locations on the mating surface is varied to compensate for local variations in the thickness profile of the MEMS device and/or the flatness of the mating surface of the substrate.
公开/授权文献
- US07628875B2 MEMS device and assembly method 公开/授权日：2009-12-08
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