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公开(公告)号：US20080063830A1
公开(公告)日：2008-03-13
申请号：US11519204
申请日：2006-09-12
CPC分类号： B81C3/001 , B81C2203/032 , Y10T428/20 , Y10T428/218 , Y10T428/219 , Y10T428/249953
摘要： A method of bonding a MEMS device to a substrate to form a MEMS device assembly. A thickness profile of the MEMS device and/or the flatness of the mating surface of the substrate is determined. An adhesive is deposited onto a mating surface of the MEMS device and/or the mating surface of the substrate. The mating surfaces of the MEMS device and substrate are brought together, such that the adhesive can bond the MEMS device to the substrate. The volume of adhesive deposited at particular locations on the mating surface is varied to compensate for local variations in the thickness profile of the MEMS device and/or the flatness of the mating surface of the substrate.
摘要翻译： 将MEMS器件接合到衬底以形成MEMS器件组件的方法。 确定MEMS器件的厚度分布和/或衬底的配合表面的平坦度。 将粘合剂沉积到MEMS器件的配合表面和/或衬底的配合表面上。 MEMS器件和衬底的配合表面被带到一起，使得粘合剂可以将MEMS器件接合到衬底。 沉积在配合表面上的特定位置处的粘合剂的体积被改变以补偿MEMS装置的厚度分布的局部变化和/或基底的配合表面的平坦度。
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公开(公告)号：US09743521B2
公开(公告)日：2017-08-22
申请号：US13496539
申请日：2010-09-10
申请人： Ralph Kurt , Cornelis Slob , Marc Andre De Samber , Michael Johan Ferdinand Marie Ter Laak , Gerard Kums , Egbert Lenderink , Marcellus Jacobus Johannes Van Der Lubbe , Mark Eduard Johan Sipkes
发明人： Ralph Kurt , Cornelis Slob , Marc Andre De Samber , Michael Johan Ferdinand Marie Ter Laak , Gerard Kums , Egbert Lenderink , Marcellus Jacobus Johannes Van Der Lubbe , Mark Eduard Johan Sipkes
IPC分类号： F21V9/00 , H05K1/18 , F21S2/00 , H05B33/08 , F21V23/06 , G02F1/1335 , H01L25/075 , H05K1/11 , F21Y115/10 , F21Y113/13
CPC分类号： H05K1/181 , F21S2/005 , F21V23/06 , F21Y2113/13 , F21Y2115/10 , G02F1/133603 , G02F2001/133612 , H01L25/0753 , H01L2224/48091 , H01L2224/48227 , H05B33/0824 , H05K1/117 , H05K2201/09709 , H05K2201/10106 , H05K2201/10969 , H05K2203/049 , Y02P70/611 , H01L2924/00014
摘要： A light-emitting module (3a-c; 23; 26; 33a-c) comprising a plurality of light-sources (12a-e; 27a-h) arranged in at least a first and a second column (18a-b; 28a-c) arranged side by side and extending along a first direction of extension (X1) of the light-emitting module (3a-c; 23; 26; 33a-c); and a plurality of connector terminal pairs (13a-b, 14a-b, 15a-b, 16a-b 17a-b), each being electrically connected to a corresponding one of the light-sources (3a-c; 23; 26; 33a-c) for enabling supply of electrical power thereto. Each connector terminal pair (13a-b, 14a-b, 15a-b, 16a-b 17a-b) comprises a first connector terminal (13a, 14a, 15a, 16a 17a) and a second connector terminal (13b, 14b, 15b, 16b 17b) being arranged at opposite sides of the light-emitting module (3a-c; 23; 26; 33a-c). The light-sources (12a-e; 27a-h) are arranged in a predetermined light-source sequence along the first direction of extension (X1) of the light-emitting module (3a-c; 23; 26; 33a-c), and the connector terminal pairs (13a-b, 14a-b, 15a-b, 16a-b 17a-b) being electrically connected to the corresponding light-sources (12a-e; 27a-h) are arranged in the predetermined light-source sequence along the first direction of extension (X1) of the light-emitting module.
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公开(公告)号：US09232663B2
公开(公告)日：2016-01-05
申请号：US14241187
申请日：2012-08-29
申请人： Antonius Petrus Marinus Dingemans , Johannes Wilhelmus Weekamp , Sébastien Paul René Libon , Gerard Kums , Giovanni Cennini
发明人： Antonius Petrus Marinus Dingemans , Johannes Wilhelmus Weekamp , Sébastien Paul René Libon , Gerard Kums , Giovanni Cennini
IPC分类号： H01L21/00 , H05K3/30 , H05K3/20 , H01L25/075 , F21K99/00 , F21S4/00 , H01L27/15 , H01L33/62 , F21V21/002 , H05K13/04 , H05K1/02 , H05K3/00
CPC分类号： H05K3/303 , F21K9/90 , F21V21/002 , H01L25/0753 , H01L27/153 , H01L33/62 , H01L2924/0002 , H05K1/0209 , H05K1/0283 , H05K1/0284 , H05K1/05 , H05K3/0058 , H05K3/0097 , H05K3/202 , H05K13/046 , H05K2201/09263 , H05K2201/09781 , H05K2201/10106 , H05K2203/04 , H05K2203/1545 , H05K2203/175 , Y10T29/49144 , H01L2924/00
摘要： There is provided a method for manufacturing a light emitting diode, LED, matrix (100) comprising the steps of providing with a maintained integrity a conductor sheet (150) with a plurality of component areas (111) interconnected with meandering connection tracks (116), mounting a plurality of LEDs (120) to a respective component area thereby forming a subassembly (100′), trimming and stretching the subassembly thereby straightening the connection tracks such that an m×n LED conductor matrix is formed during the step of stretching.
摘要翻译： 提供一种用于制造发光二极管，LED，矩阵（100）的方法，包括以下步骤：提供具有与曲折连接轨道（116）互连的多个部件区域（111）的导体片（150）的完整性， ，将多个LED（120）安装到相应的部件区域，从而形成子组件（100'），修整和拉伸子组件，从而矫正连接轨道，使得在拉伸步骤期间形成m×n个LED导体矩阵。
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公开(公告)号：US08847386B2
公开(公告)日：2014-09-30
申请号：US12666817
申请日：2008-06-23
CPC分类号： H01H1/021 , H01L24/11 , H01L2224/05001 , H01L2224/05023 , H01L2224/0508 , H01L2224/05144 , H01L2224/05155 , H01L2224/05164 , H01L2224/05169 , H01L2224/05568 , H01L2224/05644 , H01L2224/1134 , H01L2224/13144 , H01L2924/07802 , Y10T156/10 , H01L2924/00 , H01L2924/00014
摘要： An electrical contact for a detector, the electrical component, comprising a cadmium tellurium component, a first layer formed onto the cadmium tellurium component, wherein the first layer comprises indium and a contact agent being bonded directly or indirectly to the first layer to be in electrical contact with the first layer. The contact agent may be a stud bump or a conductive adhesive interconnect being bonded indirectly to the first layer via noble metal shielding layer.
摘要翻译： 一种用于检测器的电接触件，所述电气部件包括碲碲组分，形成在所述碲碲组分上的第一层，其中所述第一层包含铟和接触剂直接或间接地接合到所述第一层以形成电 与第一层接触。 接触剂可以是通过贵金属屏蔽层间接地与第一层键合的柱状凸块或导电粘合剂互连。
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公开(公告)号：US09395071B2
公开(公告)日：2016-07-19
申请号：US14238888
申请日：2012-08-29
IPC分类号： F21V23/00 , F21K99/00 , F21V11/00 , F21Y101/02 , F21Y105/00
CPC分类号： F21V23/001 , F21K9/20 , F21K9/90 , F21S4/15 , F21V11/00 , F21V23/00 , F21Y2105/10 , F21Y2115/10 , Y10T29/49117
摘要： The present invention relates to a grid-shaped lighting module (13; 23) comprising: a plurality of electrically conducting wires (15a-b) defining a grid with nodes (16a-c); and a plurality of solid-state light-sources (17a-c) each being arranged at a respective one of the nodes and connected to two electrically conducting wires of the plurality of electrically conducting wires. The electrically conducting wires (15a-b) are pleated such that the grid-shaped lighting module (13; 23) exhibits a 3D-topography. Various embodiments of the present invention provide improved mechanical stability and allows for thin illumination panels based on the grid-shaped lighting module.
摘要翻译： 本发明涉及一种栅格照明模块（13; 23），包括：多个限定具有节点（16a-c）的栅格的导电线（15a-b）; 和多个固态光源（17a-c），每个固态光源（17a-c）分别布置在相应的一个节点处并且连接到多个导电线中的两个导电线。 导电线（15a-b）被打褶，使得格子状照明模块（13; 23）呈现3D形貌。 本发明的各种实施例提供了改进的机械稳定性并且允许基于栅格形照明模块的薄照明面板。
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公开(公告)号：US20140168974A1
公开(公告)日：2014-06-19
申请号：US14238888
申请日：2012-08-29
CPC分类号： F21V23/001 , F21K9/20 , F21K9/90 , F21S4/15 , F21V11/00 , F21V23/00 , F21Y2105/10 , F21Y2115/10 , Y10T29/49117
摘要： The present invention relates to a grid-shaped lighting module (13; 23) comprising: a plurality of electrically conducting wires (15a-b) defining a grid with nodes (16a-c); and a plurality of solid-state light-sources (17a-c) each being arranged at a respective one of the nodes and connected to two electrically conducting wires of the plurality of electrically conducting wires. The electrically conducting wires (15a-b) are pleated such that the grid-shaped lighting module (13; 23) exhibits a 3D-topography. Various embodiments of the present invention provide improved mechanical stability and allows for thin illumination panels based on the grid-shaped lighting module.
摘要翻译： 本发明涉及一种栅格照明模块（13; 23），包括：多个限定具有节点（16a-c）的栅格的导电线（15a-b）; 和多个固态光源（17a-c），每个固态光源（17a-c）分别布置在相应的一个节点处并连接到多个导电线中的两个导电线。 导电线（15a-b）被打褶，使得格子状照明模块（13; 23）呈现3D形貌。 本发明的各种实施例提供了改进的机械稳定性并且允许基于栅格形照明模块的薄照明面板。
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公开(公告)号：US07628875B2
公开(公告)日：2009-12-08
申请号：US11519204
申请日：2006-09-12
IPC分类号： B32B37/12
CPC分类号： B81C3/001 , B81C2203/032 , Y10T428/20 , Y10T428/218 , Y10T428/219 , Y10T428/249953
摘要： A method of bonding a MEMS device to a substrate to form a MEMS device assembly. A thickness profile of the MEMS device and/or the flatness of the mating surface of the substrate is determined. An adhesive is deposited onto a mating surface of the MEMS device and/or the mating surface of the substrate. The mating surfaces of the MEMS device and substrate are brought together, such that the adhesive can bond the MEMS device to the substrate. The volume of adhesive deposited at particular locations on the mating surface is varied to compensate for local variations in the thickness profile of the MEMS device and/or the flatness of the mating surface of the substrate.
摘要翻译： 将MEMS器件接合到衬底以形成MEMS器件组件的方法。 确定MEMS器件的厚度分布和/或衬底的配合表面的平坦度。 将粘合剂沉积到MEMS器件的配合表面和/或衬底的配合表面上。 MEMS器件和衬底的配合表面被带到一起，使得粘合剂可以将MEMS器件接合到衬底。 沉积在配合表面上的特定位置处的粘合剂的体积被改变以补偿MEMS装置的厚度分布的局部变化和/或基底的配合表面的平坦度。
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公开(公告)号：US20140209942A1
公开(公告)日：2014-07-31
申请号：US14241187
申请日：2012-08-29
申请人： Antonius Petrus Marinus Dingemans , Johannes Wilhelmus Weekamp , Sébastien Paul René Libon , Gerard Kums , Giovanni Cennini
发明人： Antonius Petrus Marinus Dingemans , Johannes Wilhelmus Weekamp , Sébastien Paul René Libon , Gerard Kums , Giovanni Cennini
CPC分类号： H05K3/303 , F21K9/90 , F21V21/002 , H01L25/0753 , H01L27/153 , H01L33/62 , H01L2924/0002 , H05K1/0209 , H05K1/0283 , H05K1/0284 , H05K1/05 , H05K3/0058 , H05K3/0097 , H05K3/202 , H05K13/046 , H05K2201/09263 , H05K2201/09781 , H05K2201/10106 , H05K2203/04 , H05K2203/1545 , H05K2203/175 , Y10T29/49144 , H01L2924/00
摘要： There is provided a method for manufacturing a light emitting diode, LED, matrix (100) comprising the steps of providing with a maintained integrity a conductor sheet (150) with a plurality of component areas (111) interconnected with meandering connection tracks (116), mounting a plurality of LEDs (120) to a respective component area thereby forming a subassembly (100″), trimming and stretching the subassembly thereby straightening the connection tracks such that an m×n LED conductor matrix is formed during the step of stretching.
摘要翻译： 提供一种用于制造发光二极管，LED，矩阵（100）的方法，包括以下步骤：提供具有与曲折连接轨道（116）互连的多个部件区域（111）的导体片（150）的完整性， ，将多个LED（120）安装到相应的部件区域，从而形成子组件（100“），修整和拉伸子组件，从而校正连接轨道，使得在拉伸步骤期间形成m×n个LED导体矩阵。
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公开(公告)号：US20120170265A1
公开(公告)日：2012-07-05
申请号：US13496539
申请日：2010-09-10
申请人： Ralph Kurt , Cornelis Slob , Marc Andre De Samber , Michael Johan Ferdinand Marie Ter Laak , Gerard Kums , Egbert Lenderink , Marcellus Jacobus Johannes Van Der Lubbe , Mark Eduard Johan Sipkes
发明人： Ralph Kurt , Cornelis Slob , Marc Andre De Samber , Michael Johan Ferdinand Marie Ter Laak , Gerard Kums , Egbert Lenderink , Marcellus Jacobus Johannes Van Der Lubbe , Mark Eduard Johan Sipkes
CPC分类号： H05K1/181 , F21S2/005 , F21V23/06 , F21Y2113/13 , F21Y2115/10 , G02F1/133603 , G02F2001/133612 , H01L25/0753 , H01L2224/48091 , H01L2224/48227 , H05B33/0824 , H05K1/117 , H05K2201/09709 , H05K2201/10106 , H05K2201/10969 , H05K2203/049 , Y02P70/611 , H01L2924/00014
摘要： A light-emitting module (3a-c; 23; 26; 33a-c) comprising a plurality of light-sources (12a-e; 27a-h) arranged in at least a first and a second column (18a-b; 28a-c) arranged side by side and extending along a first direction of extension (X1) of the light-emitting module (3a-c; 23; 26; 33a-c); and a plurality of connector terminal pairs (13a-b, 14a-b, 15a-b, 16a-b 17a-b), each being electrically connected to a corresponding one of the light-sources (3a-c; 23; 26; 33a-c) for enabling supply of electrical power thereto. Each connector terminal pair (13a-b, 14a-b, 15a-b, 16a-b 17a-b) comprises a first connector terminal (13a, 14a, 15a, 16a 17a) and a second connector terminal (13b, 14b, 15b, 16b 17b) being arranged at opposite sides of the light-emitting module (3a-c; 23; 26; 33a-c). The light-sources (12a-e; 27a-h) are arranged in a predetermined light-source sequence along the first direction of extension (X1) of the light-emitting module (3a-c; 23; 26; 33a-c), and the connector terminal pairs (13a-b, 14a-b, 15a-b, 16a-b 17a-b) being electrically connected to the corresponding light-sources (12a-e; 27a-h) are arranged in the predetermined light-source sequence along the first direction of extension (X1) of the light-emitting module.
摘要翻译： 包括布置在至少第一和第二列（18a-b; 28a）中的多个光源（12a-e; 27a-h）的发光模块（3a-c; 23; 26; 33a-c） -c），沿着所述发光模块（3a-c; 23; 26; 33a-c）的第一延伸方向（X1）延伸; 以及多个连接器端子对（13a-b，14a-b，15a-b，16a-b 17a-b），每个连接器端子对电连接到相应的一个光源（3a-c; 23; 26; 33a-c），用于使其能够供电。 每个连接器端子对（13a-b，14a-b，15a-b，16a-b 17a-b）包括第一连接器端子（13a，14a，15a，16a 17a）和第二连接器端子（13b，14b，15b ，16b 17b）布置在发光模块（3a-c; 23; 26; 33a-c）的相对侧。 光源（12a-e; 27a-h）沿着发光模块（3a-c; 23; 26; 33a-c）的第一延伸方向（X1）以预定的光源顺序排列， ，并且电连接到对应的光源（12a-e; 27a-h）的连接器端子对（13a-b，14a-b，15a-b，16a-b 17a-b）被布置在预定的光 沿着发光模块的第一延伸方向（X1）的源序列。
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公开(公告)号：US20100184341A1
公开(公告)日：2010-07-22
申请号：US12666817
申请日：2008-06-23
CPC分类号： H01H1/021 , H01L24/11 , H01L2224/05001 , H01L2224/05023 , H01L2224/0508 , H01L2224/05144 , H01L2224/05155 , H01L2224/05164 , H01L2224/05169 , H01L2224/05568 , H01L2224/05644 , H01L2224/1134 , H01L2224/13144 , H01L2924/07802 , Y10T156/10 , H01L2924/00 , H01L2924/00014
摘要： An electrical contact for a cadmium tellurium component, in particular a cadmium zinc tellurium component comprising a cadmium tellurium component, a first layer (21) formed onto the cadmium tellurium component (10), wherein the first layer (21) comprises indium and a contact agent (30) being bonded directly or indirectly to the first layer (21) to be in electrical contact with the first layer (21). The contact agent may be a stud bump or a conductive adhesive interconnect being bonded indirectly to the first layer via noble metal shielding layer.
摘要翻译： 碲碲组分的电接触，特别是包含碲镉组分的镉锌碲组分，形成在碲碲组分（10）上的第一层（21），其中第一层（21）包含铟和接触 试剂（30）直接或间接地与第一层（21）接合以与第一层（21）电接触。 接触剂可以是通过贵金属屏蔽层间接地与第一层键合的柱状凸块或导电粘合剂互连。
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