MEMS device and assembly method
    3.
    发明授权
    MEMS device and assembly method 有权
    MEMS器件和组装方法

    公开(公告)号:US07628875B2

    公开(公告)日:2009-12-08

    申请号:US11519204

    申请日:2006-09-12

    Abstract: A method of bonding a MEMS device to a substrate to form a MEMS device assembly. A thickness profile of the MEMS device and/or the flatness of the mating surface of the substrate is determined. An adhesive is deposited onto a mating surface of the MEMS device and/or the mating surface of the substrate. The mating surfaces of the MEMS device and substrate are brought together, such that the adhesive can bond the MEMS device to the substrate. The volume of adhesive deposited at particular locations on the mating surface is varied to compensate for local variations in the thickness profile of the MEMS device and/or the flatness of the mating surface of the substrate.

    Abstract translation: 将MEMS器件接合到衬底以形成MEMS器件组件的方法。 确定MEMS器件的厚度分布和/或衬底的配合表面的平坦度。 将粘合剂沉积到MEMS器件的配合表面和/或衬底的配合表面上。 MEMS器件和衬底的配合表面被带到一起,使得粘合剂可以将MEMS器件接合到衬底。 沉积在配合表面上的特定位置处的粘合剂的体积被改变以补偿MEMS装置的厚度分布的局部变化和/或基底的配合表面的平坦度。

    MEMS device and assembly method
    6.
    发明申请
    MEMS device and assembly method 有权
    MEMS器件和组装方法

    公开(公告)号:US20080063830A1

    公开(公告)日:2008-03-13

    申请号:US11519204

    申请日:2006-09-12

    Abstract: A method of bonding a MEMS device to a substrate to form a MEMS device assembly. A thickness profile of the MEMS device and/or the flatness of the mating surface of the substrate is determined. An adhesive is deposited onto a mating surface of the MEMS device and/or the mating surface of the substrate. The mating surfaces of the MEMS device and substrate are brought together, such that the adhesive can bond the MEMS device to the substrate. The volume of adhesive deposited at particular locations on the mating surface is varied to compensate for local variations in the thickness profile of the MEMS device and/or the flatness of the mating surface of the substrate.

    Abstract translation: 将MEMS器件接合到衬底以形成MEMS器件组件的方法。 确定MEMS器件的厚度分布和/或衬底的配合表面的平坦度。 将粘合剂沉积到MEMS器件的配合表面和/或衬底的配合表面上。 MEMS器件和衬底的配合表面被带到一起,使得粘合剂可以将MEMS器件接合到衬底。 沉积在配合表面上的特定位置处的粘合剂的体积被改变以补偿MEMS装置的厚度分布的局部变化和/或基底的配合表面的平坦度。

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