发明申请
- 专利标题： Electrodeposited Copper Foil with Carrier Foil with a Primer Resin Layer and Manufacturing Method Thereof
- 专利标题（中）： 具有引物树脂层的载体箔的电沉积铜箔及其制造方法
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申请号： US11662475申请日： 2005-09-09
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公开(公告)号： US20080107865A1公开(公告)日： 2008-05-08
- 发明人: Tetsuhiro Matsunaga , Toshifumi Matsushima , Tetsuro Sato , Kensuke Nakamura , Hiroyuki Kon , Kenichiro Iwakiri
- 申请人： Tetsuhiro Matsunaga , Toshifumi Matsushima , Tetsuro Sato , Kensuke Nakamura , Hiroyuki Kon , Kenichiro Iwakiri
- 申请人地址： JP Tokyo
- 专利权人： MITSUI MINING & SMELTING CO., LTD.
- 当前专利权人： MITSUI MINING & SMELTING CO., LTD.
- 当前专利权人地址： JP Tokyo
- 优先权： JP2004-264640 20040910
- 国际申请： PCT/JP05/16609 WO 20050909
- 主分类号： B32B3/00
- IPC分类号： B32B3/00 ; C25D7/00
摘要：
Present invention provides an electrodeposited copper foil with carrier foil that assure high bonding strength between a surface of the bulk copper layer and a resin substrate layer even when surface roughness is low, and hardly occurs delamination even when pin holes and the like remain in a bulk copper layer or in the side wall of the through holes or via holes and the like after contact with a desmear solution and the like. To solve such a problem, electrodeposited copper foil with carrier foil with a primer resin layer comprising a bonding interface layer, a bulk copper layer, a plated Ni—Zn alloy layer and a primer resin layer which is formed in this order at least on one surface of the carrier foil is applied.
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