公开(公告)号：US20080107865A1

公开(公告)日：2008-05-08

申请号：US11662475

申请日：2005-09-09

申请人： Tetsuhiro Matsunaga ,  Toshifumi Matsushima ,  Tetsuro Sato ,  Kensuke Nakamura ,  Hiroyuki Kon ,  Kenichiro Iwakiri

发明人： Tetsuhiro Matsunaga ,  Toshifumi Matsushima ,  Tetsuro Sato ,  Kensuke Nakamura ,  Hiroyuki Kon ,  Kenichiro Iwakiri

IPC分类号： B32B3/00 ,  C25D7/00

CPC分类号： C25D7/0614 ,  B32B7/06 ,  B32B15/01 ,  B32B15/08 ,  B32B15/14 ,  B32B15/20 ,  B32B27/08 ,  B32B27/26 ,  B32B27/285 ,  B32B27/286 ,  B32B27/38 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2255/24 ,  B32B2255/28 ,  B32B2270/00 ,  B32B2457/08 ,  C22C19/002 ,  C23C28/00 ,  C25D3/562 ,  H05K3/025 ,  H05K3/384 ,  H05K3/389 ,  H05K2201/0358 ,  H05K2203/0723 ,  Y10T428/12569 ,  Y10T428/24355

摘要： Present invention provides an electrodeposited copper foil with carrier foil that assure high bonding strength between a surface of the bulk copper layer and a resin substrate layer even when surface roughness is low, and hardly occurs delamination even when pin holes and the like remain in a bulk copper layer or in the side wall of the through holes or via holes and the like after contact with a desmear solution and the like. To solve such a problem, electrodeposited copper foil with carrier foil with a primer resin layer comprising a bonding interface layer, a bulk copper layer, a plated Ni—Zn alloy layer and a primer resin layer which is formed in this order at least on one surface of the carrier foil is applied.

摘要翻译： 本发明提供了一种具有载体箔的电沉积铜箔，即使在表面粗糙度低的情况下也能保证体铜层的表面与树脂基材层之间的高结合强度，即使销孔等保持体积也难以发生分层 铜层或通孔的侧壁或与去污溶液等接触后的通孔等。 为了解决这个问题，具有载体箔的电沉积铜箔具有底层树脂层，该底层树脂层包括接合界面层，体铜层，镀Ni-Zn合金层和底漆树脂层，该层以该顺序至少一个地形成 涂布载体箔的表面。

公开(公告)号：US08304091B2

公开(公告)日：2012-11-06

申请号：US11662475

申请日：2005-09-09

申请人： Tetsuhiro Matsunaga ,  Toshifumi Matsushima ,  Tetsuro Sato ,  Kensuke Nakamura ,  Hiroyuki Kon ,  Kenichiro Iwakiri

发明人： Tetsuhiro Matsunaga ,  Toshifumi Matsushima ,  Tetsuro Sato ,  Kensuke Nakamura ,  Hiroyuki Kon ,  Kenichiro Iwakiri

IPC分类号： B32B15/092 ,  C25D5/34

CPC分类号： C25D7/0614 ,  B32B7/06 ,  B32B15/01 ,  B32B15/08 ,  B32B15/14 ,  B32B15/20 ,  B32B27/08 ,  B32B27/26 ,  B32B27/285 ,  B32B27/286 ,  B32B27/38 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2255/24 ,  B32B2255/28 ,  B32B2270/00 ,  B32B2457/08 ,  C22C19/002 ,  C23C28/00 ,  C25D3/562 ,  H05K3/025 ,  H05K3/384 ,  H05K3/389 ,  H05K2201/0358 ,  H05K2203/0723 ,  Y10T428/12569 ,  Y10T428/24355

摘要： Present invention provides an electrodeposited copper foil with carrier foil that assure high bonding strength between a surface of the bulk copper layer and a resin substrate layer even when surface roughness is low, and hardly occurs delamination even when pin holes and the like remain in a bulk copper layer or in the side wall of the through holes or via holes and the like after contact with a desmear solution and the like. To solve such a problem, electrodeposited copper foil with carrier foil with a primer resin layer comprising a bonding interface layer, a bulk copper layer, a plated Ni—Zn alloy layer and a primer resin layer which is formed in this order at least on one surface of the carrier foil is applied.

摘要翻译： 本发明提供了一种具有载体箔的电沉积铜箔，即使在表面粗糙度低的情况下也能保证体铜层的表面与树脂基材层之间的高结合强度，即使销孔等保持体积也难以发生分层 铜层或通孔的侧壁或与去污溶液等接触后的通孔等。 为了解决这个问题，具有载体箔的电沉积铜箔具有底层树脂层，该底层树脂层包括接合界面层，体铜层，镀Ni-Zn合金层和底漆树脂层，该层以该顺序至少一个地形成 涂布载体箔的表面。

公开(公告)号：US20100068511A1

公开(公告)日：2010-03-18

申请号：US12447575

申请日：2007-10-30

申请人： Tetsuhiro Matsunaga ,  Toshifumi Matsushima ,  Tetsuro Sato

发明人： Tetsuhiro Matsunaga ,  Toshifumi Matsushima ,  Tetsuro Sato

IPC分类号： B32B15/08 ,  C25D5/56 ,  B05D3/02

CPC分类号： H05K3/384 ,  C25D5/12 ,  C25D5/34 ,  C25D5/48 ,  C25D5/50 ,  C25D5/56 ,  C25D7/12 ,  H05K3/386 ,  H05K3/389 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/072 ,  H05K2203/0723 ,  Y10T428/265 ,  Y10T428/27

摘要： Object of the invention is to provide a surface-treated copper foil comprising a rust-proofing treatment layer without chromium on an electro-deposited copper foil in which the peel strength of the circuits in processing of the printed wiring board and the chemical resistance against to the peel loss and the like are excellent. To achieve the object, the surface-treated copper foil characterized in comprising a rust-proofing treatment layer and a silane coupling agent layer on a bonding surface of an electro-deposited copper foil to an insulating resin substrate wherein the rust-proofing treatment layer is prepared by forming a nickel alloy layer having a thickness by weight of 5 mg/m2 to 50 mg/m2 and a tin layer having a thickness by weight of 5 mg/m2 to 40 mg/m2 in this order, and the silane coupling agent layer is provided on the rust-proofing treatment layer is employed. Further, a surface-treated copper foil with a very thin primer resin layer characterized by that a very thin primer resin layer having an equivalent thickness of 1 μm to 5 μm is provided on a bonding surface to the insulating resin substrate of the surface-treated copper foil without roughening treatment according to the present invention is employed.

摘要翻译： 本发明的目的是提供一种表面处理铜箔，其在电沉积铜箔上包含无铬的防锈处理层，其中印刷线路板的加工中的电路的剥离强度和耐化学腐蚀性 剥离损失等优异。 为了实现该目的，表面处理铜箔的特征在于在电解铜箔与绝缘树脂基板的接合面上具有防锈处理层和硅烷偶联剂层，其中防锈处理层为 通过以5mg / m 2至50mg / m 2的厚度形成厚度为5mg / m 2至40mg / m 2的锡层，并制备硅烷偶联剂 采用防锈处理层设置有层。 此外，具有非常薄的底漆树脂层的表面处理铜箔的特征在于，在与表面处理的绝缘树脂基板的接合面上设置相当厚度为1μm〜5μm的非常薄的底漆树脂层 采用根据本发明的不进行粗糙化处理的铜箔。

公开(公告)号：US08497026B2

公开(公告)日：2013-07-30

申请号：US13254733

申请日：2010-06-25

申请人： Tetsuhiro Matsunaga ,  Hajime Watanabe ,  Joe Nishikawa ,  Tetsuro Sato

发明人： Tetsuhiro Matsunaga ,  Hajime Watanabe ,  Joe Nishikawa ,  Tetsuro Sato

IPC分类号： B32B5/18

CPC分类号： C25D1/08 ,  B01D39/2041 ,  B01D2239/10 ,  B01D2239/1208 ,  C25D1/04 ,  C25D3/04 ,  C25D7/00 ,  H01M4/74 ,  H01M4/75 ,  H01M4/80 ,  H01M4/808 ,  H05K1/09 ,  H05K2201/0116 ,  H05K2201/0281 ,  H05K2201/0355 ,  Y10T428/12042 ,  Y10T428/12424 ,  Y10T428/12431 ,  Y10T428/12479 ,  Y10T428/249986

摘要： A porous metal foil of the present invention comprises a two-dimensional network structure composed of metal fibers. This porous metal foil has superior properties and can be obtained in a highly productive and cost effective manner.

摘要翻译： 本发明的多孔金属箔包括由金属纤维构成的二维网状结构体。 该多孔金属箔具有优异的性能，可以以高生产率和成本有效的方式获得。

公开(公告)号：US20110318600A1

公开(公告)日：2011-12-29

申请号：US13254733

申请日：2010-06-25

申请人： Tetsuhiro Matsunaga ,  Hajime Watanabe ,  Joe Nishikawa ,  Tetsuro Sato

发明人： Tetsuhiro Matsunaga ,  Hajime Watanabe ,  Joe Nishikawa ,  Tetsuro Sato

IPC分类号： B32B5/18 ,  B05D5/12 ,  B05D3/00 ,  B32B3/26

CPC分类号： C25D1/08 ,  B01D39/2041 ,  B01D2239/10 ,  B01D2239/1208 ,  C25D1/04 ,  C25D3/04 ,  C25D7/00 ,  H01M4/74 ,  H01M4/75 ,  H01M4/80 ,  H01M4/808 ,  H05K1/09 ,  H05K2201/0116 ,  H05K2201/0281 ,  H05K2201/0355 ,  Y10T428/12042 ,  Y10T428/12424 ,  Y10T428/12431 ,  Y10T428/12479 ,  Y10T428/249986

摘要： A porous metal foil of the present invention comprises a two-dimensional network structure composed of metal fibers. This porous metal foil has superior properties and can be obtained in a highly productive and cost effective manner.

摘要翻译： 本发明的多孔金属箔包括由金属纤维构成的二维网状结构体。 该多孔金属箔具有优异的性能，可以以高生产率和成本有效的方式获得。

公开(公告)号：US20060057420A1

公开(公告)日：2006-03-16

申请号：US10532717

申请日：2003-10-29

申请人： Toshiko Yokota ,  Tetsuhiro Matsunaga ,  Susumu Takahashi ,  Hideaki Matsushima ,  Takuya Yamamoto ,  Makoto Dobashi

发明人： Toshiko Yokota ,  Tetsuhiro Matsunaga ,  Susumu Takahashi ,  Hideaki Matsushima ,  Takuya Yamamoto ,  Makoto Dobashi

IPC分类号： C23C14/00 ,  G01K5/66 ,  B32B15/20

CPC分类号： H01G4/33 ,  H05K1/162 ,  H05K2201/0154 ,  H05K2201/0179 ,  H05K2201/0195 ,  H05K2201/0355 ,  Y10T428/12514 ,  Y10T428/12903 ,  Y10T428/24917 ,  Y10T428/24926

摘要： To provide a dielectric-layer-provided copper foil or the like for extremely improving the product yield while making the most use of the increase effect of an electric capacity of a thin dielectric layer using the sputtering vapor deposition method. In the case of dielectric-layer-provided copper foils respectively having a dielectric layer on one side of a copper foil, the dielectric layer 6 is an inorganic-oxide sputter film having a thickness of 1.0 μm or less and formed on the one side of the copper foil in accordance with the sputtering vapor deposition method and the dielectric-layer-provided copper foils for respectively forming a capacitor layer, characterized in that a pit-like defective portion generated on the inorganic-oxide sputter film is sealed by polyimide resin are used.

摘要翻译： 提供一种提供介电层的铜箔等，以极大地提高产品产率，同时利用溅射气相沉积法最大限度地利用薄介电层的电容的增加效果。

公开(公告)号：US08187723B2

公开(公告)日：2012-05-29

申请号：US11915038

申请日：2006-06-12

申请人： Tetsuhiro Matsunaga

发明人： Tetsuhiro Matsunaga

IPC分类号： B05D3/02 ,  B32B15/04 ,  B32B15/08 ,  B32B15/092 ,  B32B15/20

CPC分类号： C23C28/00 ,  B05D2202/45 ,  B05D2350/65 ,  H05K3/384 ,  H05K3/386 ,  H05K3/389 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/0307 ,  H05K2203/0723 ,  Y10T428/12438 ,  Y10T428/12556 ,  Y10T428/12569 ,  Y10T428/12715 ,  Y10T428/12722 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/2495 ,  Y10T428/24967 ,  Y10T428/265 ,  Y10T428/27 ,  Y10T428/31663

摘要： A surface-treated copper foil comprising an electrodeposited copper foil with a chromium-free rust-proofing layer which exhibits good performance in peel strength and resistance to peel loss after chemical treatment as a printed wiring board. The surface-treated copper foil comprises a rust-proofing layer and a silane coupling agent layer formed on an electrodeposited copper foil , wherein the rust-proofing layer comprises a nickel layer having a thickness by weight of 5 to 40 mg/m2 and a tin layer having a thickness by weight of 5 to 40 mg/m2 stacked in this order, and the silane coupling layer is applied on top of the tin layer. The surface-treated copper foil may be further coated with a very thin primer resin layer having a thickness of 0.5 to 5 μm.

摘要翻译： 一种表面处理铜箔，其包含具有无铬防锈层的电沉积铜箔，其作为印刷线路板在化学处理后表现出良好的剥离强度和耐剥离损失性能。 表面处理铜箔包括在电沉积铜箔上形成的防锈层和硅烷偶联剂层，其中防锈层包括厚度为5至40mg / m 2的镍层和锡 层叠重量为5〜40mg / m 2的层，并且将硅烷偶联层涂覆在锡层的顶部。 表面处理的铜箔可以进一步涂覆厚度为0.5至5μm的非常薄的底漆树脂层。

公开(公告)号：US20090029186A1

公开(公告)日：2009-01-29

申请号：US11915038

申请日：2006-06-12

申请人： Tetsuhiro Matsunaga

发明人： Tetsuhiro Matsunaga

IPC分类号： B21C37/02 ,  B05D3/02

CPC分类号： C23C28/00 ,  B05D2202/45 ,  B05D2350/65 ,  H05K3/384 ,  H05K3/386 ,  H05K3/389 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/0307 ,  H05K2203/0723 ,  Y10T428/12438 ,  Y10T428/12556 ,  Y10T428/12569 ,  Y10T428/12715 ,  Y10T428/12722 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/2495 ,  Y10T428/24967 ,  Y10T428/265 ,  Y10T428/27 ,  Y10T428/31663

摘要： It is an object of the present invention to provide a surface-treated copper foil comprising an electrodeposited copper foil with a chromium-free rust-proofing layer which exhibits good performance in peel strength and resistance to peel loss after chemical treatment as a printed wiring board. To achieve this object, a surface-treated copper foil comprising an rust-proofing layer and a silane coupling agent layer formed on the bonding surface of an electrodeposited copper foil to an insulating resin substrate, wherein the rust-proofing layer comprises a nickel layer having a thickness by weight of 5 to 40 mg/m2 and a tin layer having a thickness by weight of 5 to 40 mg/m2 stacked in this order, and the rust-proofing layer is provided with the silane coupling layer on the surface is applied. Also a surface-treated copper foil coated with a very thin primer resin layer, comprising the surface-treated copper foil according to the present invention (without roughening treatment), and a very thin primer resin layer having a thickness by calculation of 0.5 to 5-micron meter provided on the bonding surface of the surface-treated copper foil to the insulating resin substrate is applied.

摘要翻译： 本发明的目的是提供一种表面处理铜箔，其包括具有无铬防锈层的电沉积铜箔，其作为印刷线路板在化学处理后表现出良好的剥离强度和耐剥离损失性能 。 为了实现该目的，在电解铜箔与绝缘树脂基板的接合面上形成有防锈层和硅烷偶联剂层的表面处理铜箔，其中，防锈层包括具有 按重量计5〜40mg / m 2，层叠厚度为5〜40mg / m2的锡层依次层叠，并且在其表面上设置有硅烷偶合层的防锈层 。 另外，涂覆有非常薄的底漆树脂层的表面处理铜箔，包括根据本发明的表面处理铜箔（不经粗糙化处理）和非常薄的底漆树脂层，其厚度计算为0.5至5 应用表面处理铜箔与绝缘树脂基板的接合面上的微米计。

公开(公告)号：US20130323602A1

公开(公告)日：2013-12-05

申请号：US13985599

申请日：2012-03-23

申请人： Tetsuhiro Matsunaga ,  Hajime Watanabe ,  Joe Nishikawa

发明人： Tetsuhiro Matsunaga ,  Hajime Watanabe ,  Joe Nishikawa

IPC分类号： H01M4/80 ,  H01M4/04

CPC分类号： H01M4/80 ,  B05D1/12 ,  B05D1/14 ,  B05D5/12 ,  B05D7/50 ,  B22F7/04 ,  C22C49/00 ,  C25D1/04 ,  C25D1/08 ,  C25D3/04 ,  C25D3/38 ,  C25D5/12 ,  C25D7/0635 ,  H01G9/016 ,  H01G11/68 ,  H01M4/0402 ,  H01M4/661 ,  H01M4/665 ,  H01M10/0525 ,  Y02E60/13 ,  Y10T29/49115

摘要： A composite metal foil is provided comprising a porous metal foil comprising a two-dimensional network structure composed of a metal fiber, and a primer provided on at least a part of the interior and/or periphery of pores of the porous metal foil. According to the present invention, it is possible to obtain a composite metal foil which has a desired function imparted by a primer in addition to superior properties derived from a porous metal foil, in a highly productive and cost effective manner that is suited for continuous production.

摘要翻译： 提供一种复合金属箔，其包括由金属纤维构成的二维网络结构的多孔金属箔和设置在多孔金属箔的孔的内部和/或周围的至少一部分上的底漆。 根据本发明，可以以适合于连续生产的高生产率和成本有效的方式获得具有由底漆赋予的期望功能的复合金属箔以及来自多孔金属箔的优异性能 。

公开(公告)号：US07524552B2

公开(公告)日：2009-04-28

申请号：US10532717

申请日：2003-10-29

申请人： Toshiko Yokota ,  Tetsuhiro Matsunaga ,  Susumu Takahashi ,  Hideaki Matsushima ,  Takuya Yamamoto ,  Makoto Dobashi

发明人： Toshiko Yokota ,  Tetsuhiro Matsunaga ,  Susumu Takahashi ,  Hideaki Matsushima ,  Takuya Yamamoto ,  Makoto Dobashi

IPC分类号： B32B3/00 ,  B65D85/00

CPC分类号： H01G4/33 ,  H05K1/162 ,  H05K2201/0154 ,  H05K2201/0179 ,  H05K2201/0195 ,  H05K2201/0355 ,  Y10T428/12514 ,  Y10T428/12903 ,  Y10T428/24917 ,  Y10T428/24926

摘要： To provide a dielectric-layer-provided copper foil or the like for extremely improving the product yield while making the most use of the increase effect of an electric capacity of a thin dielectric layer using the sputtering vapor deposition method.In the case of dielectric-layer-provided copper foils respectively having a dielectric layer on one side of a copper foil, the dielectric layer 6 is an inorganic-oxide sputter film having a thickness of 1.0 μm or less and formed on the one side of the copper foil in accordance with the sputtering vapor deposition method and the dielectric-layer-provided copper foils for respectively forming a capacitor layer, characterized in that a pit-like defective portion generated on the inorganic-oxide sputter film is sealed by polyimide resin are used.

摘要翻译： 提供一种提供介电层的铜箔等，以极大地提高产品产率，同时利用溅射气相沉积法最大限度地利用薄介电层的电容的增加效果。 在铜箔的一侧分别具有电介质层的电介质层的铜箔的情况下，电介质层6是厚度为1.0μm以下的无机氧化物溅射膜，形成在 根据溅射气相沉积法的铜箔和用于分别形成电容器层的介电层提供的铜箔，其特征在于，在无机氧化物溅射膜上产生的凹坑状缺陷部分被聚酰亚胺树脂密封 用过的。