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1.发明申请Electrodeposited Copper Foil with Carrier Foil with a Primer Resin Layer and Manufacturing Method Thereof 失效具有引物树脂层的载体箔的电沉积铜箔及其制造方法公开(公告)号：US20080107865A1
公开(公告)日：2008-05-08
申请号：US11662475
申请日：2005-09-09
申请人： Tetsuhiro Matsunaga , Toshifumi Matsushima , Tetsuro Sato , Kensuke Nakamura , Hiroyuki Kon , Kenichiro Iwakiri
发明人： Tetsuhiro Matsunaga , Toshifumi Matsushima , Tetsuro Sato , Kensuke Nakamura , Hiroyuki Kon , Kenichiro Iwakiri
CPC分类号： C25D7/0614 , B32B7/06 , B32B15/01 , B32B15/08 , B32B15/14 , B32B15/20 , B32B27/08 , B32B27/26 , B32B27/285 , B32B27/286 , B32B27/38 , B32B2255/10 , B32B2255/205 , B32B2255/24 , B32B2255/28 , B32B2270/00 , B32B2457/08 , C22C19/002 , C23C28/00 , C25D3/562 , H05K3/025 , H05K3/384 , H05K3/389 , H05K2201/0358 , H05K2203/0723 , Y10T428/12569 , Y10T428/24355
摘要： Present invention provides an electrodeposited copper foil with carrier foil that assure high bonding strength between a surface of the bulk copper layer and a resin substrate layer even when surface roughness is low, and hardly occurs delamination even when pin holes and the like remain in a bulk copper layer or in the side wall of the through holes or via holes and the like after contact with a desmear solution and the like. To solve such a problem, electrodeposited copper foil with carrier foil with a primer resin layer comprising a bonding interface layer, a bulk copper layer, a plated Ni—Zn alloy layer and a primer resin layer which is formed in this order at least on one surface of the carrier foil is applied.
摘要翻译： 本发明提供了一种具有载体箔的电沉积铜箔，即使在表面粗糙度低的情况下也能保证体铜层的表面与树脂基材层之间的高结合强度，即使销孔等保持体积也难以发生分层 铜层或通孔的侧壁或与去污溶液等接触后的通孔等。 为了解决这个问题，具有载体箔的电沉积铜箔具有底层树脂层，该底层树脂层包括接合界面层，体铜层，镀Ni-Zn合金层和底漆树脂层，该层以该顺序至少一个地形成 涂布载体箔的表面。
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2.发明授权Electrodeposited copper foil with carrier foil with a primer resin layer and manufacturing method thereof 失效具有底漆树脂层的载体箔的电沉积铜箔及其制造方法公开(公告)号：US08304091B2
公开(公告)日：2012-11-06
申请号：US11662475
申请日：2005-09-09
申请人： Tetsuhiro Matsunaga , Toshifumi Matsushima , Tetsuro Sato , Kensuke Nakamura , Hiroyuki Kon , Kenichiro Iwakiri
发明人： Tetsuhiro Matsunaga , Toshifumi Matsushima , Tetsuro Sato , Kensuke Nakamura , Hiroyuki Kon , Kenichiro Iwakiri
IPC分类号： B32B15/092 , C25D5/34
CPC分类号： C25D7/0614 , B32B7/06 , B32B15/01 , B32B15/08 , B32B15/14 , B32B15/20 , B32B27/08 , B32B27/26 , B32B27/285 , B32B27/286 , B32B27/38 , B32B2255/10 , B32B2255/205 , B32B2255/24 , B32B2255/28 , B32B2270/00 , B32B2457/08 , C22C19/002 , C23C28/00 , C25D3/562 , H05K3/025 , H05K3/384 , H05K3/389 , H05K2201/0358 , H05K2203/0723 , Y10T428/12569 , Y10T428/24355
摘要： Present invention provides an electrodeposited copper foil with carrier foil that assure high bonding strength between a surface of the bulk copper layer and a resin substrate layer even when surface roughness is low, and hardly occurs delamination even when pin holes and the like remain in a bulk copper layer or in the side wall of the through holes or via holes and the like after contact with a desmear solution and the like. To solve such a problem, electrodeposited copper foil with carrier foil with a primer resin layer comprising a bonding interface layer, a bulk copper layer, a plated Ni—Zn alloy layer and a primer resin layer which is formed in this order at least on one surface of the carrier foil is applied.
摘要翻译： 本发明提供了一种具有载体箔的电沉积铜箔，即使在表面粗糙度低的情况下也能保证体铜层的表面与树脂基材层之间的高结合强度，即使销孔等保持体积也难以发生分层 铜层或通孔的侧壁或与去污溶液等接触后的通孔等。 为了解决这个问题，具有载体箔的电沉积铜箔具有底层树脂层，该底层树脂层包括接合界面层，体铜层，镀Ni-Zn合金层和底漆树脂层，该层以该顺序至少一个地形成 涂布载体箔的表面。
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公开(公告)号：US07199326B2
公开(公告)日：2007-04-03
申请号：US11135121
申请日：2005-05-23
申请人： Hiroyuki Kon
发明人： Hiroyuki Kon
IPC分类号： B23K11/11
CPC分类号： B23K11/31
摘要： A positioning jig for a spot-welding electrode includes an attaching portion for temporarily attaching to a workpiece. A positioning portion of the jig is disposed in parallel to a central axis of the attaching portion and spaced from the central axis. The positioning portion has an imaginary central axis coinciding with the central axis of the attaching portion. With the attaching portion attached to that part of a workpiece surface which is to be spot welded, the electrode is set on the central axis of the attaching portion. An inclination of the electrode is corrected to make the electrode stand parallel to the positioning portion such that, even when the workpiece surface is curved, the electrode can be positioned perpendicularly to the workpiece surface part to be spot welded.
摘要翻译： 用于点焊电极的定位夹具包括临时附接到工件的安装部。 夹具的定位部分平行于安装部分的中心轴线并与中心轴线间隔开。 定位部具有与安装部的中心轴一致的假想中心轴。 将附着部附着在要点焊的工件表面的部分上，将电极设置在安装部的中心轴上。 校正电极的倾斜度，使电极平行于定位部分，使得即使当工件表面弯曲时，电极可以垂直于要被点焊的工件表面部分定位。
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公开(公告)号：US20060226935A1
公开(公告)日：2006-10-12
申请号：US11401347
申请日：2006-04-11
申请人： Hiroyuki Kon , Masayuki Morimoto
发明人： Hiroyuki Kon , Masayuki Morimoto
IPC分类号： H01H51/22
CPC分类号： H01H50/54 , H01H1/18 , H01H1/2083 , H01H1/50
摘要： An electromagnetic relay is provided which is capable of reducing a contact bounce at time of closing a contact. The electromagnetic relay is so configured that an opposed angle θ is 0°
摘要翻译： 提供一种电磁继电器，其能够在闭合触点时减少触点反弹。 电磁继电器被配置为使得相对的角度θ为0°<45°，当从常开固定触点和可动触头滑动的方向观察时，常开固定触点与 活动接触弹簧
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公开(公告)号：US20050263495A1
公开(公告)日：2005-12-01
申请号：US11135121
申请日：2005-05-23
申请人： Hiroyuki Kon
发明人： Hiroyuki Kon
CPC分类号： B23K11/31
摘要： A positioning jig for a spot-welding electrode includes an attaching portion for temporarily attaching to a workpiece. A positioning portion of the jig is disposed in parallel to a central axis of the attaching portion and spaced from the central axis. The positioning portion has an imaginary central axis coinciding with the central axis of the attaching portion. With the attaching portion attached to that part of a workpiece surface which is to be spot welded, the electrode is set on the central axis of the attaching portion. An inclination of the electrode is corrected to make the electrode stand parallel to the positioning portion such that, even when the workpiece surface is curved, the electrode can be positioned perpendicularly to the workpiece surface part to be spot welded.
摘要翻译： 用于点焊电极的定位夹具包括临时附接到工件的安装部。 夹具的定位部分平行于安装部分的中心轴线并与中心轴线间隔开。 定位部具有与安装部的中心轴一致的假想中心轴。 将附着部附着在要点焊的工件表面的部分上，将电极设置在安装部的中心轴上。 校正电极的倾斜度，使电极平行于定位部分，使得即使当工件表面弯曲时，电极可以垂直于要被点焊的工件表面部分定位。
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公开(公告)号：US07423504B2
公开(公告)日：2008-09-09
申请号：US11401347
申请日：2006-04-11
申请人： Hiroyuki Kon , Masayuki Morimoto
发明人： Hiroyuki Kon , Masayuki Morimoto
CPC分类号： H01H50/54 , H01H1/18 , H01H1/2083 , H01H1/50
摘要： An electromagnetic relay is provided which is capable of reducing a contact bounce at time of closing a contact. The electromagnetic relay is so configured that an opposed angle θ is 0°
摘要翻译： 提供一种电磁继电器，其能够在闭合触点时减少触点反弹。 电磁继电器被配置为使得相对的角度θ为0°<45°，当从常开固定触点和可动触头滑动的方向观察时，常开固定触点与 活动接触弹簧
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