发明申请
US20080111159A1 IMAGE SENSOR INCLUDING SPATIALLY DIFFERENT ACTIVE AND DARK PIXEL INTERCONNECT PATTERNS
有权
图像传感器包括空间不同的主动和深色像素互连图案
- 专利标题: IMAGE SENSOR INCLUDING SPATIALLY DIFFERENT ACTIVE AND DARK PIXEL INTERCONNECT PATTERNS
- 专利标题(中): 图像传感器包括空间不同的主动和深色像素互连图案
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申请号: US11560019申请日: 2006-11-15
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公开(公告)号: US20080111159A1公开(公告)日: 2008-05-15
- 发明人: Jeffrey P. Gambino , Mark D. Jaffe , Robert K. Leidy , Richard J. Rassel
- 申请人: Jeffrey P. Gambino , Mark D. Jaffe , Robert K. Leidy , Richard J. Rassel
- 主分类号: H01L31/101
- IPC分类号: H01L31/101 ; H01L29/765 ; H01L23/52 ; H01L21/339
![IMAGE SENSOR INCLUDING SPATIALLY DIFFERENT ACTIVE AND DARK PIXEL INTERCONNECT PATTERNS](/abs-image/US/2008/05/15/US20080111159A1/abs.jpg.150x150.jpg)
摘要:
An interconnect layout, an image sensor including the interconnect layout and a method for fabricating the image sensor each use a first electrically active physical interconnect layout pattern within an active pixel region and a second electrically active physical interconnect layout pattern spatially different than the first electrically active physical interconnect layout pattern within a dark pixel region. The second electrically active physical interconnect layout pattern includes at least one electrically active interconnect layer interposed between a light shield layer and a photosensor region aligned therebeneath, thus generally providing a higher wiring density. The higher wiring density within the second layout pattern provides that that the image sensor may be fabricated with enhanced manufacturing efficiency and a reduction of metallization levels.