发明申请
- 专利标题: Semiconductor Light-Emitting Device, Semiconductor Light-Emitting Apparatus, and Method of Manufacturing Semiconductor Light-Emitting Device
- 专利标题(中): 半导体发光器件,半导体发光器件和半导体发光器件的制造方法
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申请号: US11568427申请日: 2005-03-31
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公开(公告)号: US20080121904A1公开(公告)日: 2008-05-29
- 发明人: Jun Suzuki , Masato Doi , Hiroyuki Okuyama , Goshi Biwa
- 申请人: Jun Suzuki , Masato Doi , Hiroyuki Okuyama , Goshi Biwa
- 申请人地址: JP Tokyo
- 专利权人: SONY CORPORATION
- 当前专利权人: SONY CORPORATION
- 当前专利权人地址: JP Tokyo
- 优先权: JP2004-132007 20040427
- 国际申请: PCT/JP05/06814 WO 20050331
- 主分类号: H01L21/329
- IPC分类号: H01L21/329 ; H01L33/00
摘要:
There is obtained a semiconductor light-emitting device capable of obtaining a high light reflectance through the use of a high-reflection metal layer formed on the side of an electrode on one side and capable of preventing migration of atoms from the high-reflectance metal layer. Semiconductor layers of the opposite conduction types are formed on the opposite sides of an active layer, and an ohmic contact layer being a thin film for contriving a decrease in contact resistance, a transparent and conductive layer, and a high-reflection metal layer for reflecting light generated in the active layer are sequentially layered on one of the semiconductor layers. Since the transparent conductive layer functions also as a barrier layer and it transmits light, a high light take-out efficiency can be obtained through the reflection at the high-reflectance metal layer.
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