Invention Application
- Patent Title: SILICON CARRIER HAVING INCREASED FLEXIBILITY
- Patent Title (中): 具有增加灵活性的硅载体
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Application No.: US11932891Application Date: 2007-10-31
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Publication No.: US20080122057A1Publication Date: 2008-05-29
- Inventor: Bucknell C. Webb
- Applicant: Bucknell C. Webb
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Main IPC: H01L23/14
- IPC: H01L23/14 ; H05K3/42
Abstract:
An apparatus and method providing flexibility to a silicon chip carrier which, in at least one embodiment, comprises multiple chips and a silicon chip carrier having thinned regions between some adjacent chips, thus, allowing for increased flexibility and reduced package warpage.
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