发明申请
- 专利标题: PLANAR VERTICAL RESISTOR AND BOND PAD RESISTOR AND RELATED METHOD
- 专利标题(中): 平面垂直电阻和焊盘电阻及相关方法
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申请号: US11954782申请日: 2007-12-12
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公开(公告)号: US20080132027A1公开(公告)日: 2008-06-05
- 发明人: Douglas D. Coolbaugh , Timothy J. Dalton , Daniel C. Edelstein , Ebenezer E. Eshun , Jeffrey P. Gambino , Kevin S. Petrarca , Anthony K. Stamper , Richard P. Volant
- 申请人: Douglas D. Coolbaugh , Timothy J. Dalton , Daniel C. Edelstein , Ebenezer E. Eshun , Jeffrey P. Gambino , Kevin S. Petrarca , Anthony K. Stamper , Richard P. Volant
- 主分类号: H01L21/20
- IPC分类号: H01L21/20
摘要:
Resistors that avoid the problems of miniaturization of semiconductor devices and a related method are disclosed. In one embodiment, a resistor includes a planar resistor material that extends vertically within at least one metal layer of a semiconductor device. In another embodiment, a resistor includes a resistor material layer extending between a first bond pad and a second bond pad of a semiconductor device. The two embodiments can be used alone or together. A related method for generating the resistors is also disclosed.