发明申请
US20080137318A1 Compliant structure for an electronic device, method of manufacturing same, and system containing same
有权
用于电子设备的符合标准的结构，其制造方法和包含该装置的系统
- 专利标题： Compliant structure for an electronic device, method of manufacturing same, and system containing same
- 专利标题（中）： 用于电子设备的符合标准的结构，其制造方法和包含该装置的系统
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申请号： US11636250申请日： 2006-12-08
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公开(公告)号： US20080137318A1公开(公告)日： 2008-06-12
- 发明人: Sudarshan Rangaraj , Shankar Ganapathysubramanian , Richard Harries , Mitul Modi , Sankara J. Subramanian
- 申请人： Sudarshan Rangaraj , Shankar Ganapathysubramanian , Richard Harries , Mitul Modi , Sankara J. Subramanian
- 主分类号： H05K7/02
- IPC分类号： H05K7/02 ; H05K3/22
摘要：
A compliant structure for an electronic device comprises a substrate (110) composed of a first material (111) and a compliant zone (120) within the substrate. A plurality of solder joints (280) are located between, and form a connection between, the substrate and the electronic device (290). The compliant zone reduces the degree of deformation experienced by the solder joints due to thermal mismatch loading between the substrate and the die during attachment of the die to the substrate (chip attach). This reduction in solder joint deformation reduces the likelihood that the solder joints will crack.
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