公开(公告)号：US07659192B2

公开(公告)日：2010-02-09

申请号：US11648498

申请日：2006-12-29

申请人： Andrew Yeohi ,  Guotao Wang ,  Sairam Agraharam ,  Sudarshan Rangaraj

发明人： Andrew Yeohi ,  Guotao Wang ,  Sairam Agraharam ,  Sudarshan Rangaraj

IPC分类号： H01L21/44

CPC分类号： H01L24/13 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Methods of forming a microelectronic device and associated structures are described. Those methods may comprise forming a die-side conductive interconnect on a substrate, wherein the die-side conductive interconnect comprises a columnar portion and a base portion, and wherein a diameter of the base portion is greater than a diameter of the columnar portion.

摘要翻译： 描述形成微电子器件和相关结构的方法。 这些方法可以包括在衬底上形成裸片侧导电互连，其中裸片侧导电互连包括柱状部分和基部，并且其中基部的直径大于柱状部分的直径。

公开(公告)号：US20080157392A1

公开(公告)日：2008-07-03

申请号：US12044202

申请日：2008-03-07

申请人： Andrew Yeohi ,  Guotao Wang ,  Sairam Agraharam ,  Sudarshan Rangaraj

发明人： Andrew Yeohi ,  Guotao Wang ,  Sairam Agraharam ,  Sudarshan Rangaraj

IPC分类号： H01L23/498

CPC分类号： H01L24/13 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Methods of forming a microelectronic device and associated structures are described. Those methods may comprise forming a die-side conductive interconnect on a substrate, wherein the die-side conductive interconnect comprises a columnar portion and a base portion, and wherein a diameter of the base portion is greater than a diameter of the columnar portion.

摘要翻译： 描述形成微电子器件和相关结构的方法。 这些方法可以包括在衬底上形成裸片侧导电互连，其中裸片侧导电互连包括柱状部分和基部，并且其中基部的直径大于柱状部分的直径。

公开(公告)号：US20060134830A1

公开(公告)日：2006-06-22

申请号：US11020433

申请日：2004-12-21

申请人： Kris Frutschy ,  Sudarshan Rangaraj ,  Tom Lappin

发明人： Kris Frutschy ,  Sudarshan Rangaraj ,  Tom Lappin

IPC分类号： H01L21/48

CPC分类号： H01L24/80 ,  H01L24/81 ,  H01L2224/81001 ,  H01L2224/81097 ,  H01L2224/812 ,  H01L2224/81815 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/3025

摘要： Embodiments of a method for attaching a die to a substrate using a flame or other heat source are disclosed. The flame may be produced by combustible gas. Also disclosed are embodiments of a system for performing die attach using a flame. Other embodiments are described and claimed.

摘要翻译： 公开了使用火焰或其他热源将管芯附接到衬底的方法的实施例。 火焰可以由可燃气体产生。 还公开了用于使用火焰进行管芯附着的系统的实施例。 描述和要求保护其他实施例。

公开(公告)号：US20080157356A1

公开(公告)日：2008-07-03

申请号：US11648498

申请日：2006-12-29

申请人： Andrew Yeohi ,  Guotao Wang ,  Sairam Agraharam ,  Sudarshan Rangaraj

发明人： Andrew Yeohi ,  Guotao Wang ,  Sairam Agraharam ,  Sudarshan Rangaraj

IPC分类号： H01L23/48 ,  H01L21/44

CPC分类号： H01L24/13 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Methods of forming a microelectronic device and associated structures are described. Those methods may comprise forming a die-side conductive interconnect on a substrate, wherein the die-side conductive interconnect comprises a columnar portion and a base portion, and wherein a diameter of the base portion is greater than a diameter of the columnar portion.

摘要翻译： 描述形成微电子器件和相关结构的方法。 这些方法可以包括在衬底上形成裸片侧导电互连，其中裸片侧导电互连包括柱状部分和基部，并且其中基部的直径大于柱状部分的直径。

公开(公告)号：US07692307B2

公开(公告)日：2010-04-06

申请号：US11636250

申请日：2006-12-08

申请人： Sudarshan Rangaraj ,  Shankar Ganapathysubramanian ,  Richard Harries ,  Mitul Modi ,  Sankara J. Subramanian

发明人： Sudarshan Rangaraj ,  Shankar Ganapathysubramanian ,  Richard Harries ,  Mitul Modi ,  Sankara J. Subramanian

IPC分类号： H01L23/48

CPC分类号： H05K1/0271 ,  H01L23/13 ,  H01L2924/0002 ,  H05K3/3436 ,  H05K2201/0133 ,  H05K2201/0187 ,  H05K2201/068 ,  Y10T29/49158 ,  H01L2924/00

摘要： A compliant structure for an electronic device comprises a substrate (110) composed of a first material (111) and a compliant zone (120) within the substrate. A plurality of solder joints (280) are located between, and form a connection between, the substrate and the electronic device (290). The compliant zone reduces the degree of deformation experienced by the solder joints due to thermal mismatch loading between the substrate and the die during attachment of the die to the substrate (chip attach). This reduction in solder joint deformation reduces the likelihood that the solder joints will crack.

摘要翻译： 用于电子设备的柔性结构包括由衬底内的第一材料（111）和柔性区（120）组成的衬底（110）。 多个焊接接头（280）位于衬底和电子器件（290）之间，并形成衬底和电子器件（290）之间的连接。 柔性区域在将管芯附着到衬底（芯片连接）期间由于衬底和裸片之间的热失配加载而减小焊点所经历的变形程度。 焊点变形的这种减少降低了焊点会破裂的可能性。

公开(公告)号：US20070231952A1

公开(公告)日：2007-10-04

申请号：US11395102

申请日：2006-03-31

申请人： Kristopher Frutschy ,  Sudarshan Rangaraj ,  Kevin George

发明人： Kristopher Frutschy ,  Sudarshan Rangaraj ,  Kevin George

IPC分类号： H01L21/00

CPC分类号： H05K3/3494 ,  H01L21/563 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81054 ,  H01L2224/81209 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1433 ,  H05K3/3436 ,  H05K2203/1121 ,  H01L2924/00 ,  H01L2924/3512

摘要： Method of forming a microelectronic package using control of die and substrate differential expansions. The method includes: providing a die-substrate combination including a substrate, a die disposed on the substrate, and plurality of solder paste disposed between the die and the substrate; reflowing the solder paste by exposing the die-substrate combination to temperatures changes including heating the die-substrate combination to liquefy the solder paste, and cooling down the die-substrate combination until the solder paste has solidified to form solder joints to yield the package; and controlling an expansion of the die and the substrate at least during cooling down to mitigate a relative difference in volumetric strain between the die and the substrate. Controlling may comprise exposing the die-substrate combination to pressure changes at least during cooling down.

摘要翻译： 使用管芯和衬底差分扩展的控制形成微电子封装的方法。 该方法包括：提供包括基板，设置在基板上的管芯和设置在管芯和基板之间的多个焊膏的管芯基板组合; 通过将模具 - 基板组合暴露于包括加热模具 - 基板组合以液化焊膏的温度变化，以及冷却模具 - 基板组合直到焊膏固化形成焊点以产生封装，来回流焊膏; 以及至少在冷却期间控制模具和基材的膨胀以减轻模头和基板之间的体积应变的相对差异。 控制可以包括至少在冷却期间使模具 - 基板组合暴露于压力变化。

公开(公告)号：US20080137318A1

公开(公告)日：2008-06-12

申请号：US11636250

申请日：2006-12-08

申请人： Sudarshan Rangaraj ,  Shankar Ganapathysubramanian ,  Richard Harries ,  Mitul Modi ,  Sankara J. Subramanian

发明人： Sudarshan Rangaraj ,  Shankar Ganapathysubramanian ,  Richard Harries ,  Mitul Modi ,  Sankara J. Subramanian

IPC分类号： H05K7/02 ,  H05K3/22

CPC分类号： H05K1/0271 ,  H01L23/13 ,  H01L2924/0002 ,  H05K3/3436 ,  H05K2201/0133 ,  H05K2201/0187 ,  H05K2201/068 ,  Y10T29/49158 ,  H01L2924/00

摘要： A compliant structure for an electronic device comprises a substrate (110) composed of a first material (111) and a compliant zone (120) within the substrate. A plurality of solder joints (280) are located between, and form a connection between, the substrate and the electronic device (290). The compliant zone reduces the degree of deformation experienced by the solder joints due to thermal mismatch loading between the substrate and the die during attachment of the die to the substrate (chip attach). This reduction in solder joint deformation reduces the likelihood that the solder joints will crack.

摘要翻译： 用于电子设备的柔性结构包括由衬底内的第一材料（111）和柔性区（120）组成的衬底（110）。 多个焊接接头（280）位于衬底和电子器件（290）之间，并形成衬底和电子器件（290）之间的连接。 柔性区域在将管芯附着到衬底（芯片连接）期间由于衬底和裸片之间的热失配加载而减小焊点所经历的变形程度。 焊点变形的这种减少降低了焊点会破裂的可能性。