发明申请
US20080150147A1 HIGH SURFACE AREA ALUMINUM BOND PAD FOR THROUGH-WAFER CONNECTIONS TO AN ELECTRONIC PACKAGE
有权
高表面积的铝合金焊盘，用于通过电缆连接到电子包装
- 专利标题： HIGH SURFACE AREA ALUMINUM BOND PAD FOR THROUGH-WAFER CONNECTIONS TO AN ELECTRONIC PACKAGE
- 专利标题（中）： 高表面积的铝合金焊盘，用于通过电缆连接到电子包装
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申请号： US12046737申请日： 2008-03-12
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公开(公告)号： US20080150147A1公开(公告)日： 2008-06-26
- 发明人: James W. Adkisson , Jeffrey P. Gambino , Mark D. Jaffe , Richard J. Rassel , Edmund J. Sprogis
- 申请人： James W. Adkisson , Jeffrey P. Gambino , Mark D. Jaffe , Richard J. Rassel , Edmund J. Sprogis
- 申请人地址： US NY Armonk
- 专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址： US NY Armonk
- 主分类号： H01L23/488
- IPC分类号： H01L23/488
摘要：
A bond pad for effecting through-wafer connections to an integrated circuit or electronic package and method of producing thereof. The bond pad includes a high surface area aluminum bond pad in order to resultingly obtain a highly reliable, low resistance connection between bond pad and electrical leads.