发明申请
- 专利标题: POWER DEVICE PACKAGE
- 专利标题(中): 电源设备包
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申请号: US11965983申请日: 2007-12-28
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公开(公告)号: US20080157310A1公开(公告)日: 2008-07-03
- 发明人: Joo-sang Lee , O-seob Jeon , Yong-suk Kwon , Frank Chen , Adams Zhu
- 申请人: Joo-sang Lee , O-seob Jeon , Yong-suk Kwon , Frank Chen , Adams Zhu
- 申请人地址: KR Bucheon city
- 专利权人: Fairchild Korea Semiconductor, Ltd.
- 当前专利权人: Fairchild Korea Semiconductor, Ltd.
- 当前专利权人地址: KR Bucheon city
- 优先权: KR10-2006-0137730 20061229
- 主分类号: H01L23/495
- IPC分类号: H01L23/495
摘要:
A power device package according to the one embodiment of the present invention includes an insulating substrate with an interconnection pattern disposed on the insulating substrate. The interconnection pattern comprises a single conductive layer comprising a first metal layer, and a multiple conductive layer comprising another first metal layer and a second metal layer disposed on the another first metal layer. A plurality of wires are attached to an upper surface of the single conductive layer and/or an upper surface of the second metal layer of the multiple conductive layer. Contact pads on a power control semiconductor chip and a low power semiconductor chip driving the power control semiconductor chip are electrically connected to the wires.
公开/授权文献
- US07800224B2 Power device package 公开/授权日:2010-09-21