-
公开(公告)号：US20080251739A1
公开(公告)日：2008-10-16
申请号：US11735257
申请日：2007-04-13
IPC分类号： G02B6/42
CPC分类号： G02B6/43 , H01L2224/48091 , H01L2924/13091 , H01L2924/00014 , H01L2924/00
摘要： A method is disclosed. The method includes forming a substrate with a leadframe and a molding compound. The molding compound fills internal spaces in the leadframe and forms a dam structure. An optical emitter and an optical receiver are placed on the substrate. An optically transmissive medium is formed between the optical emitter and optical receiver.
摘要翻译： 公开了一种方法。 该方法包括用引线框和模塑料形成基板。 模塑料填充引线框架中的内部空间并形成坝体结构。 将光发射器和光接收器放置在基板上。 在光发射器和光接收器之间形成光透射介质。
-
公开(公告)号：US07800224B2
公开(公告)日：2010-09-21
申请号：US11965983
申请日：2007-12-28
申请人： Joo-sang Lee , O-seob Jeon , Yong-suk Kwon , Frank Chen , Adams Zhu
发明人： Joo-sang Lee , O-seob Jeon , Yong-suk Kwon , Frank Chen , Adams Zhu
IPC分类号： H01L23/495
CPC分类号： H01L23/49575 , H01L23/49531 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/0603 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48139 , H01L2224/48227 , H01L2224/4903 , H01L2224/49051 , H01L2224/49111 , H01L2224/49171 , H01L2224/73265 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/2076 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A power device package according to the one embodiment of the present invention includes an insulating substrate with an interconnection pattern disposed on the insulating substrate. The interconnection pattern comprises a single conductive layer comprising a first metal layer, and a multiple conductive layer comprising another first metal layer and a second metal layer disposed on the another first metal layer. A plurality of wires are attached to an upper surface of the single conductive layer and/or an upper surface of the second metal layer of the multiple conductive layer. Contact pads on a power control semiconductor chip and a low power semiconductor chip driving the power control semiconductor chip are electrically connected to the wires.
摘要翻译： 根据本发明的一个实施例的功率器件封装包括布置在绝缘衬底上的布线图案的绝缘衬底。 互连图案包括包括第一金属层的单个导电层和包括另一第一金属层和设置在另一第一金属层上的第二金属层的多导电层。 多个导线附着到单个导电层的上表面和/或多导电层的第二金属层的上表面。 驱动功率控制半导体芯片的功率控制半导体芯片和低功率半导体芯片上的接触焊盘电连接到导线。
-
公开(公告)号：US07659531B2
公开(公告)日：2010-02-09
申请号：US11735257
申请日：2007-04-13
IPC分类号： G02B27/00
CPC分类号： G02B6/43 , H01L2224/48091 , H01L2924/13091 , H01L2924/00014 , H01L2924/00
摘要： A method is disclosed. The method includes forming a substrate with a leadframe and a molding compound. The molding compound fills internal spaces in the leadframe and forms a dam structure. An optical emitter and an optical receiver are placed on the substrate. An optically transmissive medium is formed between the optical emitter and optical receiver.
摘要翻译： 公开了一种方法。 该方法包括用引线框和模塑料形成基板。 模塑料填充引线框架中的内部空间并形成坝体结构。 将光发射器和光接收器放置在基板上。 在光发射器和光接收器之间形成光透射介质。
-
公开(公告)号：US20080157310A1
公开(公告)日：2008-07-03
申请号：US11965983
申请日：2007-12-28
申请人： Joo-sang Lee , O-seob Jeon , Yong-suk Kwon , Frank Chen , Adams Zhu
发明人： Joo-sang Lee , O-seob Jeon , Yong-suk Kwon , Frank Chen , Adams Zhu
IPC分类号： H01L23/495
CPC分类号： H01L23/49575 , H01L23/49531 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/0603 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48139 , H01L2224/48227 , H01L2224/4903 , H01L2224/49051 , H01L2224/49111 , H01L2224/49171 , H01L2224/73265 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/2076 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A power device package according to the one embodiment of the present invention includes an insulating substrate with an interconnection pattern disposed on the insulating substrate. The interconnection pattern comprises a single conductive layer comprising a first metal layer, and a multiple conductive layer comprising another first metal layer and a second metal layer disposed on the another first metal layer. A plurality of wires are attached to an upper surface of the single conductive layer and/or an upper surface of the second metal layer of the multiple conductive layer. Contact pads on a power control semiconductor chip and a low power semiconductor chip driving the power control semiconductor chip are electrically connected to the wires.
摘要翻译： 根据本发明的一个实施例的功率器件封装包括布置在绝缘衬底上的布线图案的绝缘衬底。 互连图案包括包括第一金属层的单个导电层和包括另一第一金属层和设置在另一第一金属层上的第二金属层的多导电层。 多个导线附着到单个导电层的上表面和/或多导电层的第二金属层的上表面。 驱动功率控制半导体芯片的功率控制半导体芯片和低功率半导体芯片上的接触焊盘电连接到导线。
-
-
-
搜索结果
4 条记录 (耗时 0.013 秒)