发明申请
- 专利标题： ADDRESSABLE HIERARCHICAL METAL WIRE TEST METHODOLOGY
- 专利标题（中）： 可寻址分层金属线测试方法
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申请号： US11619307申请日： 2007-01-03
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公开(公告)号： US20080160656A1公开(公告)日： 2008-07-03
- 发明人: Kaushik Chanda , Lawrence Clevenger , Timothy J. Dalton , Louis L. C. Hsu , Chih-Chao Yang
- 申请人： Kaushik Chanda , Lawrence Clevenger , Timothy J. Dalton , Louis L. C. Hsu , Chih-Chao Yang
- 申请人地址： US NY Armonk
- 专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址： US NY Armonk
- 主分类号： H01L21/66
- IPC分类号： H01L21/66 ; G01R31/26
摘要：
A method of monitoring and testing electro-migration and time dependent dielectric breakdown includes forming an addressable wiring test array, which includes a plurality or horizontally disposed metal wiring and a plurality of segmented, vertically disposed probing wiring, performing a single row continuity/resistance check to determine which row of said metal wiring is open, performing a full serpentine continuity/resistance check, and determining a position of short defects.
公开/授权文献
- US07749778B2 Addressable hierarchical metal wire test methodology 公开/授权日：2010-07-06
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