发明申请
US20080164589A1 POWER DEVICE PACKAGE COMPRISING METAL TAB DIE ATTACH PADDLE (DAP) AND METHOD OF FABRICATING THE PACKAGE
有权
包含金属贴纸连接垫（DAP）的电源装置包装和制造包装的方法
- 专利标题： POWER DEVICE PACKAGE COMPRISING METAL TAB DIE ATTACH PADDLE (DAP) AND METHOD OF FABRICATING THE PACKAGE
- 专利标题（中）： 包含金属贴纸连接垫（DAP）的电源装置包装和制造包装的方法
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申请号： US11970911申请日： 2008-01-08
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公开(公告)号： US20080164589A1公开(公告)日： 2008-07-10
- 发明人: Joon-seo Son , O-seob Jeon , Taek-keun Lee , Byoung-ok Lee
- 申请人： Joon-seo Son , O-seob Jeon , Taek-keun Lee , Byoung-ok Lee
- 申请人地址： KR Bucheon City
- 专利权人： Fairchild Korea Semiconductor, Ltd.
- 当前专利权人： Fairchild Korea Semiconductor, Ltd.
- 当前专利权人地址： KR Bucheon City
- 优先权： KR10-2007-0002184 20070108
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L21/56
摘要：
A metal tab die attach paddle (DAP) disposed between the lead frame and a power device die in a power device package reduces the stress exerted on the semiconductor power device die caused by the different coefficients of thermal expansion (CTE) of the semiconductor power device die and the lead frame. In addition the power device package substantially prevents impurities from penetrating into the power device package by increasing the surface creepage distance of a sealant resulting from the metal tab DAP and an optional swaging of the lead frame.