发明申请
- 专利标题: Semiconductor device and method of fabricating the same
- 专利标题(中): 半导体装置及其制造方法
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申请号: US12000504申请日: 2007-12-13
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公开(公告)号: US20080179648A1公开(公告)日: 2008-07-31
- 发明人: Dae-won Ha , Tae-hyun An , Min-young Shim
- 申请人: Dae-won Ha , Tae-hyun An , Min-young Shim
- 优先权: KR10-2007-0008610 20070126
- 主分类号: H01L27/108
- IPC分类号: H01L27/108 ; H01L21/8242
摘要:
A semiconductor device having a semiconductor substrate including a first region and a second region is provided. The semiconductor device further includes a gate electrode on the first region and having a first sidewall and a second sidewall, a first source region in the first region proximate to the first sidewall, a first drain region in the first region proximate to the second sidewall, an upper electrode on the second region and having a first sidewall and a second sidewall, a second source region in the second region proximate to the first sidewall of the upper electrode, and a second drain region in the second region proximate to the second sidewall of the upper electrode, wherein an impurity doping concentration of the first source region and the first drain region is greater than an impurity doping concentration of the second source region and the second drain region.
公开/授权文献
- US08004023B2 Semiconductor device and method of fabricating the same 公开/授权日:2011-08-23
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