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发明申请
US20080191335A1 CMOS IMAGE SENSOR CHIP SCALE PACKAGE WITH DIE RECEIVING OPENING AND METHOD OF THE SAME 审中-公开
CMOS图像传感器芯片尺寸包装，接收开口及其方法

CMOS IMAGE SENSOR CHIP SCALE PACKAGE WITH DIE RECEIVING OPENING AND METHOD OF THE SAME
摘要：
The present invention provides a structure of package comprising a substrate with a die through hole and a contact through holes structure formed there through, wherein a terminal pad is formed under the contact through hole structure and a contact pad is formed on a upper surface of the substrate. A die having a micro lens area is disposed within the die through hole by adhesion. A thick dielectric layer is formed on the die and the substrate except the micro lens, bonding pads and contact pads. A wire bonding is formed on the die and the substrate, wherein the wire bonding is coupled to the die and the contact pad. And core paste is filled into the gap between the die edge and the sidewall of the die through hole of the substrate. A transparent cover is disposed on the die and the thick dielectric layer by adhesion to create a gap between the transparent cover.
摘要（中）：

本发明提供一种封装结构，其包括具有通孔的基板和在其上形成的接触通孔结构，其中端子焊盘形成在接触通孔结构下方，并且接触焊盘形成在 基质。 具有微透镜区域的模具通过粘附设置在模具通孔内。 除了微透镜，接合焊盘和接触焊盘之外，在裸片和基板上形成厚的电介质层。 在芯片和基板上形成引线接合，其中引线接合耦合到管芯和接触焊盘。 并且核芯浆料填充到芯片边缘和基板的管芯通孔的侧壁之间的间隙中。 通过粘合将透明盖设置在模具和厚介电层上，以在透明盖之间产生间隙。

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