发明申请
US20080211075A1 IMAGE SENSOR CHIP SCALE PACKAGE HAVING INTER-ADHESION WITH GAP AND METHOD OF THE SAME
审中-公开
具有间隙的粘合剂的图像传感器芯片尺寸包装及其相同方法
- 专利标题： IMAGE SENSOR CHIP SCALE PACKAGE HAVING INTER-ADHESION WITH GAP AND METHOD OF THE SAME
- 专利标题（中）： 具有间隙的粘合剂的图像传感器芯片尺寸包装及其相同方法
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申请号： US11950921申请日： 2007-12-05
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公开(公告)号： US20080211075A1公开(公告)日： 2008-09-04
- 发明人: Wen-Kun Yang , Jui-Hsien Chang , Hsien-Wen Hsu , Diann-Fang Lin
- 申请人： Wen-Kun Yang , Jui-Hsien Chang , Hsien-Wen Hsu , Diann-Fang Lin
- 专利权人： Advanced Chip Engineering Technology Inc.
- 当前专利权人： Advanced Chip Engineering Technology Inc.
- 主分类号： H01L23/04
- IPC分类号： H01L23/04 ; H01L21/71
摘要：
A structure of semiconductor device package having inter-adhesion with gap comprising: a chip with bonding pads and a sensor area embedded into a substrate with die window and inter-connecting through holes, wherein a RDL is formed over the substrate for coupling between the bonding pads and the inter-connecting through holes; a multiple rings (dam bar) formed over the substrate, the RDL, and the bonding pads area except the sensor area; an adhesive glues fill into the space of the multiple ring except the sensor area; and a transparency material bonded on the top of the multiple ring and the adhesive glues, wherein the adhesive glues adhesion between the transparency material and the multiple rings.
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