发明申请
US20080242117A1 APPARATUS TO REDUCE WAFER EDGE TEMPERATURE AND BREAKAGE OF WAFERS
审中-公开
减少波浪边缘温度和破裂的设备
- 专利标题： APPARATUS TO REDUCE WAFER EDGE TEMPERATURE AND BREAKAGE OF WAFERS
- 专利标题（中）： 减少波浪边缘温度和破裂的设备
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申请号： US11694934申请日： 2007-03-30
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公开(公告)号： US20080242117A1公开(公告)日： 2008-10-02
- 发明人: Panchapakesan Ramanarayanan , Karson Knutson , Jack Hwang , John Leonard , Sridhar Govindaraju
- 申请人： Panchapakesan Ramanarayanan , Karson Knutson , Jack Hwang , John Leonard , Sridhar Govindaraju
- 主分类号： H01L21/324
- IPC分类号： H01L21/324
摘要：
In some embodiments radiation incident on a wafer is provided to perform an annealing process, and the wafer is cooled at an edge portion to reduce temperature and stress on the wafer. Other embodiments are described and claimed.