发明申请
- 专利标题： INTEGRATED CIRCUIT DEVICE AND METHOD FOR THE PRODUCTION THEREOF
- 专利标题（中）： 集成电路装置及其生产方法
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申请号： US11869845申请日： 2007-10-10
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公开(公告)号： US20080246137A1公开(公告)日： 2008-10-09
- 发明人: Joachim Mahler , Reimund Engl , Thomas Behrens , Wolfgang Kuebler , Rainald Sander
- 申请人： Joachim Mahler , Reimund Engl , Thomas Behrens , Wolfgang Kuebler , Rainald Sander
- 申请人地址： DE Neubiberg
- 专利权人： Infineon Technologies AG
- 当前专利权人： Infineon Technologies AG
- 当前专利权人地址： DE Neubiberg
- 优先权： DE102006049949.2 20061019
- 主分类号： H01L23/52
- IPC分类号： H01L23/52 ; H01L21/00
摘要：
An integrated circuit device includes a semiconductor chip and a control chip at different supply potentials. A lead chip island includes an electrically conductive partial region and an insulation layer. The semiconductor chip is arranged on the electrically conductive partial region of the lead chip island and the control chip is cohesively fixed on the insulation layer.
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