发明申请
US20080251148A1 Fluid Handling System for Wafer Electroless Plating and Associated Methods
有权
用于晶片无电镀的流体处理系统及相关方法
- 专利标题: Fluid Handling System for Wafer Electroless Plating and Associated Methods
- 专利标题(中): 用于晶片无电镀的流体处理系统及相关方法
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申请号: US11735989申请日: 2007-04-16
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公开(公告)号: US20080251148A1公开(公告)日: 2008-10-16
- 发明人: William Thie , John M. Boyd , Fritz C. Redeker , Yezdi Dordi , John Parks , Tiruchirapalli Arunagiri , Aleksander Owczarz , Todd Balisky , Clint Thomas , Jacob Wylie
- 申请人: William Thie , John M. Boyd , Fritz C. Redeker , Yezdi Dordi , John Parks , Tiruchirapalli Arunagiri , Aleksander Owczarz , Todd Balisky , Clint Thomas , Jacob Wylie
- 申请人地址: US CA Fremont
- 专利权人: Lam Research Corporation
- 当前专利权人: Lam Research Corporation
- 当前专利权人地址: US CA Fremont
- 主分类号: B01F5/00
- IPC分类号: B01F5/00
摘要:
A chemical fluid handling system is defined to supply a number of chemicals to a number of fluid inputs of a mixing manifold. The chemical fluid handling system includes a number of fluid recirculation loops for separately pre-conditioning and controlling the supply of each of the number of chemicals. Each of the fluid recirculation loops is defined to degas, heat, and filter a particular one of the number of chemical components. The mixing manifold is defined to mix the number of chemicals to form the electroless plating solution. The mixing manifold includes a fluid output connected to a supply line. The supply line is connected to supply the electroless plating solution to a fluid bowl within an electroless plating chamber.
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