发明申请
US20080251148A1 Fluid Handling System for Wafer Electroless Plating and Associated Methods 有权
用于晶片无电镀的流体处理系统及相关方法

Fluid Handling System for Wafer Electroless Plating and Associated Methods
摘要:
A chemical fluid handling system is defined to supply a number of chemicals to a number of fluid inputs of a mixing manifold. The chemical fluid handling system includes a number of fluid recirculation loops for separately pre-conditioning and controlling the supply of each of the number of chemicals. Each of the fluid recirculation loops is defined to degas, heat, and filter a particular one of the number of chemical components. The mixing manifold is defined to mix the number of chemicals to form the electroless plating solution. The mixing manifold includes a fluid output connected to a supply line. The supply line is connected to supply the electroless plating solution to a fluid bowl within an electroless plating chamber.
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