发明申请
US20080304078A1 METHOD AND APPARATUS FOR OPTICALLY ANALYZING A SURFACE 有权
用于光学分析表面的方法和装置

METHOD AND APPARATUS FOR OPTICALLY ANALYZING A SURFACE
摘要:
In one embodiment, a system to measure defects on a surface of a wafer and an edge of the wafer using a single tool comprises a radial motor to move an optical head in a radial direction to detect defects at locations displaced from the edge of the wafer, and a rotational motor to rotate the optical head around the edge of the wafer to detect defects on the edge of the wafer.
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