摘要:
A method and apparatus for analyzing a surface of a test object employs apparatus with a scanning interferometry system which generates a windowed interferometric signal from the surface of a test object to characterize the surface of the test object.
摘要:
In one embodiment, a system to measure defects on a surface of a wafer and an edge of the wafer using a single tool comprises a radial motor to move an optical head in a radial direction to detect defects at locations displaced from the edge of the wafer, and a rotational motor to rotate the optical head around the edge of the wafer to detect defects on the edge of the wafer.
摘要:
In one embodiment, a system to measure defects on a surface of a wafer and an edge of the wafer using a single tool comprises a radial motor to move an optical head in a radial direction to detect defects at locations displaced from the edge of the wafer, and a rotational motor to rotate the optical head around the edge of the wafer to detect defects on the edge of the wafer.
摘要:
White light interferometry is used to obtain the height information of the topmost surface of an object having a transparent thin film on it. N frames of data are acquired from an interferometer while a white light fringe pattern is scanning through a field of view. The modulation fringe envelope R(n) is calculated for every pixel; and the topmost surface position at every pixel is determined as an offset of R(n).
摘要:
A method and apparatus to linearize the phase shifts produced by the wavelength-varying driving mechanism of an interferometer used in phase shift interferometry for the measurement of multiple reflective surfaces first calibrates a sequence of physical values used as the input to the driving mechanism to produce a known linear or a known constant phase shift increment between any two adjacent interferograms. The calibration process, in essence, involves the determination of the sequence of physical values, such as the voltage change with respect to the time, through the process of iteration. This sequence then is used as an input to the phase shift driving mechanism for ongoing operation of the system, thereby compensating for non-linear characteristics of the system.
摘要:
The invention provides a new dual-sided Moiré wafer analysis system that integrates wafer flatness measurement capability with wafer surface defect detection capability. The invention may be, but is not necessarily, embodied in methods and systems for simultaneously applying phase shifting reflective Moiré wafer analysis to the front and back sides of a silicon wafer and comparing or combining the front and back side height maps. This allows wafer surface height for each side of the wafer, thickness variation map, surface nanotopography, shape, flatness, and edge map to be determined with a dual-sided fringe acquisition process. The invention also improves the dynamic range of wafer analysis to measure wafers with large bows and extends the measurement area closer to the wafer edge.
摘要:
Disclosed herein is a method and apparatus for reducing measurement error resulting from temperature variations across a wafer, without measuring the wafer temperature, the temperature gradient in the surrounding air, or the distribution of the index of refraction of the air.
摘要:
A method and system is disclosed for utilizing two single-shot phase shift interferometers to simultaneously measure wafer shape and thickness variation of two sides of a wafer.This system is able to extract the front height, the back height, and the thickness variation of a wafer in a single data acquisition.This system, when utilized with a fast shutter speed, decreases the insensitivity to vibration. Algorithms are introduced that extract the true thickness variation of a wafer even when the wafer is vibrating.The effects of air turbulence can be reduced by a phase averaging technique.
摘要:
White light interferometry is used to obtain the height information of the topmost surface of an object having a transparent thin film on it. N frames of data are acquired from an interferometer while a white light fringe pattern is scanning through a field of view. The modulation fringe envelope R(n) is calculated for every pixel; and the topmost surface position at every pixel is determined as an offset of R(n).
摘要:
A system and method are provided for obtaining mapping profiles of transparent objects having a plurality of reflective surfaces. The object, the surfaces of which are to be mapped, is placed in an unequal path interferometer including a reference surface located a predetermined distance from the object. Coherent light is supplied in the interferometer from a tunable source; and multiple optical interferograms for each of the plurality of reflective surfaces are simultaneously recorded. These interferograms are simultaneously extracted through the use of a dynamically generated weighted least-square fitting technique; which separates interferograms from a set of superimposed interferograms to obtain a given interferogram for any one of the surfaces, free from errors resulting from the existence of the other interferograms.