METHOD AND APPARATUS FOR OPTICALLY ANALYZING A SURFACE
    2.
    发明申请
    METHOD AND APPARATUS FOR OPTICALLY ANALYZING A SURFACE 有权
    用于光学分析表面的方法和装置

    公开(公告)号:US20080304078A1

    公开(公告)日:2008-12-11

    申请号:US12140154

    申请日:2008-06-16

    IPC分类号: G01B11/02

    摘要: In one embodiment, a system to measure defects on a surface of a wafer and an edge of the wafer using a single tool comprises a radial motor to move an optical head in a radial direction to detect defects at locations displaced from the edge of the wafer, and a rotational motor to rotate the optical head around the edge of the wafer to detect defects on the edge of the wafer.

    摘要翻译: 在一个实施例中,使用单个工具测量晶片表面和晶片边缘上的缺陷的系统包括径向马达以沿径向方向移动光学头以检测从晶片边缘移位的位置处的缺陷 以及旋转电动机,用于围绕晶片的边缘旋转光学头以检测晶片边缘上的缺陷。