发明申请
- 专利标题： COMPONENT LAYOUT IN AN ENCLOSURE
- 专利标题（中）： 附件中的组件布局
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申请号： US12138622申请日： 2008-06-13
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公开(公告)号： US20090016010A1公开(公告)日： 2009-01-15
- 发明人: WADE D. VINSON , John P. Franz , Arthur K. Farnsworth , David W. Sherrod
- 申请人： WADE D. VINSON , John P. Franz , Arthur K. Farnsworth , David W. Sherrod
- 主分类号： G06F1/20
- IPC分类号： G06F1/20 ; G06F1/16
摘要：
An electronic module includes an enclosure having front face and a rear face. An electronic circuit board is positioned in the enclosure and a processor is mounted to the electronic circuit board. A data storage device is positioned in the enclosure such that the processor is positioned between the data storage device and the electronic circuit board.
公开/授权文献
- US08144458B2 Component layout in an enclosure 公开/授权日：2012-03-27
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