摘要:
An electronic module includes an enclosure having a front face and a rear face. An electronic circuit board is positioned in the enclosure and a processor is mounted to the electronic circuit board. A data storage device is positioned in the enclosure such that the processor is positioned between the data storage device and the electronic circuit board.
摘要:
An electronic module includes an enclosure having front face and a rear face. An electronic circuit board is positioned in the enclosure and a processor is mounted to the electronic circuit board. A data storage device is positioned in the enclosure such that the processor is positioned between the data storage device and the electronic circuit board.
摘要:
A computer system having a hard drive securing system. The hard drive securing system is operable to secure one or more hard drives to a chassis with a single operator. The hard drive securing system uses a plurality of hard drive guides, a hard drive carrier, and a securing lever to secure a plurality of hard drives to a chassis without the use of tools.
摘要:
A system, in one embodiment, may include an in-line memory module with a plurality of memory circuits disposed on a circuit board, wherein the circuit board may have an edge connector with a plurality of contact pads. The system also may include a heat spreader disposed along the plurality of memory circuits. Finally, the system may include a heat pipe, a vapor chamber, or a combination thereof, extending along the heat spreader. In another embodiment, a system may include a heat spreader configured to mount to an in-line memory module, and an evaporative cooling system at least substantially contained within dimensions of the heat spreader.
摘要:
A protective assembly for electronic components. The protective assembly has a chassis and a removable cover. The removable cover is secured to the chassis by a latch and a catch. The catch is biased by a spring to a first position. The latch slidingly engages the catch to displace the catch during the installation of the cover. The spring returning the catch to the first position when the cover is disposed on the chassis in the securing position. The panel being removeable by sliding the catch against the spring to release the latch from the catch.
摘要:
In a computer processor module/heat sink assembly, a spring clip member is used to resiliently hold a heat-generating die portion of the processor against the heat sink. Spaced retaining pins are secured to the processor module and extend through holes in the heat sink, with outer end portions of the retaining pins being captively retained in slots in the spring clip member, and portions of the clip member adjacent the outer pin ends being resiliently deformed toward the outer side of the heat sink to thereby resiliently press the processor die portion against the underside of the heat sink. The clip member may be quickly installed on and removed from the outer pin ends without the use of tools of any sort. In an alternate embodiment of the processor module/heat sink assembly, the retaining pins are secured to the heat sink and extend through holes in the processor module, with outer ends of the pins being captively and removably secured to the spring clip which is positioned on the outer side of the processor module.
摘要:
A heat sink is provided. The heat sink contains a first vapor chamber section having a top surface and a bottom surface that is in thermal contact with a heat source, a second vapor chamber section that extends vertically from the top surface of the first vapor chamber section, and heat-dissipating fins that are attached to the second vapor chamber section. The first and second vapor sections are connected to each other forming a continuous vapor chamber space.
摘要:
A system, in one embodiment, may include an in-line memory module with a plurality of memory circuits disposed on a circuit board, wherein the circuit board may have an edge connector with a plurality of contact pads. The system also may include a heat spreader disposed along the plurality of memory circuits. Finally, the system may include a heat pipe, a vapor chamber, or a combination thereof, extending along the heat spreader. In another embodiment, a system may include a heat spreader configured to mount to an in-line memory module, and an evaporative cooling system at least substantially contained within dimensions of the heat spreader.
摘要:
A computer may be easily user re-configured between desktop and tower housing orientations, with a group of the computer's front side drive units being horizontally disposed in each orientation, using a specially designed drive unit support and latch structures. A square opening is formed in the front exterior wall of the housing, and the support apparatus includes spaced apart channel structures extending inwardly into the housing from the four sides of the wall opening, with opposing pairs of the channel structures being adapted to slidably receive corresponding projections on opposite side edge portions of the drive units. In this manner, each front side drive unit in the group thereof can be supported at the opening in a first orientation in which the drive unit will be horizontally oriented with the computer in a desktop orientation, or a second orientation in which the drive unit will be horizontally oriented with the computer in a tower orientation. As a particular drive unit is inserted in either orientation, a resilient latch structure is deflected by the drive unit and then releasably locks it into place. The latch structure is defined by two perpendicular, spring-loaded latch members which are cammingly interconnected in a manner such that a drive-releasing movement of one of the latch members simultaneously forces the other latch member through its drive-releasing movement.