发明申请
US20090023368A1 POLISHING HEAD AND EDGE CONTROL RING THEREOF, AND METHOD OF INCREASING POLISHING RATE AT WAFER EDGE
审中-公开
抛光头和边缘控制环，以及在波形边缘增加抛光速率的方法
- 专利标题： POLISHING HEAD AND EDGE CONTROL RING THEREOF, AND METHOD OF INCREASING POLISHING RATE AT WAFER EDGE
- 专利标题（中）： 抛光头和边缘控制环，以及在波形边缘增加抛光速率的方法
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申请号： US11779859申请日： 2007-07-18
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公开(公告)号： US20090023368A1公开(公告)日： 2009-01-22
- 发明人: Chang-Hsin Wu , Tzu-Hung Yang , Shao-Wei Chen , Yi-Chin Liu , Yu-Siang Yang , Pei-Lin Kuo , Hui-Shen Shih
- 申请人： Chang-Hsin Wu , Tzu-Hung Yang , Shao-Wei Chen , Yi-Chin Liu , Yu-Siang Yang , Pei-Lin Kuo , Hui-Shen Shih
- 申请人地址： TW Hsinchu
- 专利权人： UNITED MICROELECTRONICS CORP.
- 当前专利权人： UNITED MICROELECTRONICS CORP.
- 当前专利权人地址： TW Hsinchu
- 主分类号： B24B7/20
- IPC分类号： B24B7/20
摘要：
A polishing head used for CMP is described, including a retaining ring that is for engaging with a wafer, a membrane and an edge control ring. The membrane includes a bottom part for engaging with the wafer, and a lip part contiguous with the bottom part. The edge control ring is disposed between the retaining ring and the membrane, including a bottom part that has an abutting surface. The abutting surface of the edge control ring contacts with the external surface of the lip part of the membrane when the membrane is not inflated.
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