发明申请
- 专利标题: SUBSTRATE TREATMENT APPARATUS
- 专利标题(中): 基板处理设备
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申请号: US12177243申请日: 2008-07-22
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公开(公告)号: US20090025637A1公开(公告)日: 2009-01-29
- 发明人: Kazuo TERADA , Kazuo Sakamoto , Takeshi Uehara
- 申请人: Kazuo TERADA , Kazuo Sakamoto , Takeshi Uehara
- 申请人地址: JP Tokyo
- 专利权人: TOKYO ELECTRON LIMITED
- 当前专利权人: TOKYO ELECTRON LIMITED
- 当前专利权人地址: JP Tokyo
- 优先权: JP2007-193049 20070725
- 主分类号: B05C13/00
- IPC分类号: B05C13/00
摘要:
A substrate treatment apparatus of the present invention includes: a holding means for rotatably holding a substrate to be treated; a coating solution supply nozzle for supplying a coating solution onto the front surface of the substrate to be treated held on the holding means; a treatment container with an upper surface open for housing them; an exhaust means for exhausting an atmosphere in the treatment container from the bottom; a multiblade centrifugal fan provided on the inner periphery of the treatment container for flowing airflow on a front surface side of the substrate to the exhaust means; and a controller for controlling the number of rotations of the multiblade centrifugal fan corresponding to the number of rotations of the substrate, wherein the number of rotations of the multiblade centrifugal fan is controlled so that turbulent airflow flowing in a circumferential direction on the front surface of the substrate generated due to the rotation of the substrate is corrected to laminar airflow flowing in a radial direction.
公开/授权文献
- US08006636B2 Substrate treatment apparatus 公开/授权日:2011-08-30